SN74LVTH543-EP

ACTIVO

Transceptores registrados octales ABT de 3.3 V con salidas de 3 estados de producto mejorado

Detalles del producto

Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -64 Input type TTL/CMOS Output type LVTTL Features Balanced outputs Technology family LVT Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -64 Input type TTL/CMOS Output type LVTTL Features Balanced outputs Technology family LVT Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 85
TSSOP (PW) 24 49.92 mm² 7.8 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • Supports Unregulated Battery Operation Down to 2.7 V
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • Supports Unregulated Battery Operation Down to 2.7 V
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

This octal transceiver is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The SN74LVTH543 contains two sets of D-type latches for temporary storage of data flowing in either direction. Separate latch-enable (LEAB\ or LEBA\) and output-enable (OEAB\ or OEBA\) inputs are provided for each register, to permit independent control in either direction of data flow.

The A-to-B enable (CEAB)\ input must be low to enter data from A or to output data from B. If CEAB is low and LEAB\ is low, the A-to-B latches are transparent; a subsequent low-to-high transition of LEAB\ puts the A latches in the storage mode. With CEAB\ and OEAB\ both low, the 3-state B outputs are active and reflect the data present at the output of the A latches. Data flow from B to A is similar, but requires using the CEBA\, LEBA\, and OEBA\ inputs.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

This octal transceiver is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The SN74LVTH543 contains two sets of D-type latches for temporary storage of data flowing in either direction. Separate latch-enable (LEAB\ or LEBA\) and output-enable (OEAB\ or OEBA\) inputs are provided for each register, to permit independent control in either direction of data flow.

The A-to-B enable (CEAB)\ input must be low to enter data from A or to output data from B. If CEAB is low and LEAB\ is low, the A-to-B latches are transparent; a subsequent low-to-high transition of LEAB\ puts the A latches in the storage mode. With CEAB\ and OEAB\ both low, the 3-state B outputs are active and reflect the data present at the output of the A latches. Data flow from B to A is similar, but requires using the CEBA\, LEBA\, and OEBA\ inputs.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

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Documentación técnica

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Tipo Título Fecha
* Data sheet SN74LVTH543-EP datasheet 07 nov 2003
* VID SN74LVTH543-EP VID V6204677 21 jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 may 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 ene 2001
Application note LVT-to-LVTH Conversion 08 dic 1998
Application note LVT Family Characteristics (Rev. A) 01 mar 1998
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

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Paquete Pasadores Descargar
TSSOP (PW) 24 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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