176-pin (PTP) package image

TMS320F28377DPTPQ ACTIVO

MCU C2000™ de 32 bits para automoción con 800 MIPS, CPU x2, CLA x2, FPU, TMU, Flash de 1024 KB, EMIF

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Información de calidad

Calificación Automotive
RoHS
REACH
Acabado de plomo / material de la bola NIPDAU
Clasificación MSL / reflujo máximo Level-3-260C-168 HR
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Información incluida:

  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo / material de la bola
  • Clasificación MSL / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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Información adicional sobre la fabricación

Información incluida:

  • Lugar de fabricación
  • Lugar de ensamblaje
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  • US ECCN: 3A991A2

Información de empaque

Encapsulado | Pines HLQFP (PTP) | 176
Rango de temperatura de funcionamiento (℃) -40 to 125
Cant. de paquetes | Transportador 40 | JEDEC TRAY (10+1)

Características para TMS320F28377D-Q1

  • Dual-core architecture
    • Two TMS320C28x 32-bit CPUs
    • 200MHz
    • IEEE 754 single-precision Floating-Point Unit (FPU)
    • Trigonometric Math Unit (TMU)
    • Viterbi/Complex Math Unit (VCU-II)
  • Two programmable Control Law Accelerators (CLAs)
    • 200MHz
    • IEEE 754 single-precision floating-point instructions
    • Executes code independently of main CPU
  • On-chip memory
    • 512KB (256KW) or 1MB (512KW) of flash (ECC-protected)
    • 172KB (86KW) or 204KB (102KW) of RAM (ECC-protected or parity-protected)
    • Dual-zone security supporting third-party development
    • Unique identification number
  • Clock and system control
    • Two internal zero-pin 10MHz oscillators
    • On-chip crystal oscillator
    • Windowed watchdog timer module
    • Missing clock detection circuitry
  • 1.2V core, 3.3V I/O design
  • System peripherals
    • Two External Memory Interfaces (EMIFs) with ASRAM and SDRAM support
    • Dual 6-channel Direct Memory Access (DMA) controllers
    • Up to 169 individually programmable, multiplexed General-Purpose Input/Output (GPIO) pins with input filtering
    • Expanded Peripheral Interrupt controller (ePIE)
    • Multiple Low-Power Mode (LPM) support with external wakeup
  • Communications peripherals
    • USB 2.0 (MAC + PHY)
    • Support for 12-pin 3.3V-compatible Universal Parallel Port (uPP) interface
    • Two Controller Area Network (CAN) modules (pin-bootable)
    • Three high-speed (up to 50MHz) SPI ports (pin-bootable)
    • Two Multichannel Buffered Serial Ports (McBSPs)
    • Four Serial Communications Interfaces (SCI/UART) (pin-bootable)
    • Two I2C interfaces (pin-bootable)
  • Analog subsystem
    • Up to four Analog-to-Digital Converters (ADCs)
      • 16-bit mode
        • 1.1MSPS each (up to 4.4MSPS system throughput)
        • Differential inputs
        • Up to 12 external channels
      • 12-bit mode
        • 3.5MSPS each (up to 14MSPS system throughput)
        • Single-ended inputs
        • Up to 24 external channels
      • Single Sample-and-Hold (S/H) on each ADC
      • Hardware-integrated post-processing of ADC conversions
        • Saturating offset calibration
        • Error from setpoint calculation
        • High, low, and zero-crossing compare, with interrupt capability
        • Trigger-to-sample delay capture
    • Eight windowed comparators with 12-bit Digital-to-Analog Converter (DAC) references
    • Three 12-bit buffered DAC outputs
  • Enhanced control peripherals
    • 24 Pulse Width Modulator (PWM) channels with enhanced features
    • 16 High-Resolution Pulse Width Modulator (HRPWM) channels
      • High resolution on both A and B channels of 8 PWM modules
      • Dead-band support (on both standard and high resolution)
    • Six Enhanced Capture (eCAP) modules
    • Three Enhanced Quadrature Encoder Pulse (eQEP) modules
    • Eight Sigma-Delta Filter Module (SDFM) input channels, 2 parallel filters per channel
      • Standard SDFM data filtering
      • Comparator filter for fast action for out of range
  • Configurable Logic Block (CLB)
    • Augments existing peripheral capability
    • Supports position manager solutions
  • Functional Safety-Compliant
    • Developed for functional safety applications
    • Documentation available to aid ISO 26262 system design up to ASIL D; IEC 61508 up to SIL 3; IEC 60730 up to Class C; and UL 1998 up to Class 2
    • Hardware integrity up to ASIL B, SIL 2
  • Safety-related certification
  • Package options:
    • Lead-free, green packaging
    • 337-ball New Fine Pitch Ball Grid Array (nFBGA) [ZWT suffix]
    • 176-pin PowerPAD™ Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP suffix]
    • 100-pin PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP) [PZP suffix]
  • Hardware Built-in Self Test (HWBIST)
  • Temperature options:
    • T: –40°C to 105°C junction
    • S: –40°C to 125°C junction
    • Q: –40°C to 125°C free-air (AEC Q100 qualification for automotive applications)

Descripción de TMS320F28377D-Q1

C2000™ 32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes the Premium performance MCUs and the Entry performance MCUs.

The TMS320F2837xD is a powerful 32-bit floating-point microcontroller unit (MCU) designed for advanced closed-loop control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; and sensing and signal processing. To accelerate application development, the DigitalPower software development kit (SDK) for C2000 MCUs and the MotorControl software development kit (SDK) for C2000™ MCUs are available. The F2837xD supports a new dual-core C28x architecture that significantly boosts system performance. The integrated analog and control peripherals also let designers consolidate control architectures and eliminate multiprocessor use in high-end systems.

The dual real-time control subsystems are based on TI’s 32-bit C28x floating-point CPUs, which provide 200MHz of signal processing performance in each core. The C28x CPUs are further boosted by the new TMU accelerator, which enables fast execution of algorithms with trigonometric operations common in transforms and torque loop calculations; and the VCU accelerator, which reduces the time for complex math operations common in encoded applications.

The F2837xD microcontroller family features two CLA real-time control coprocessors. The CLA is an independent 32-bit floating-point processor that runs at the same speed as the main CPU. The CLA responds to peripheral triggers and executes code concurrently with the main C28x CPU. This parallel processing capability can effectively double the computational performance of a real-time control system. By using the CLA to service time-critical functions, the main C28x CPU is free to perform other tasks, such as communications and diagnostics. The dual C28x+CLA architecture enables intelligent partitioning between various system tasks. For example, one C28x+CLA core can be used to track speed and position, while the other C28x+CLA core can be used to control torque and current loops.

The TMS320F2837xD supports up to 1MB (512KW) of onboard flash memory with error correction code (ECC) and up to 204KB (102KW) of SRAM. Two 128-bit secure zones are also available on each CPU for code protection.

Performance analog and control peripherals are also integrated on the F2837xD MCU to further enable system consolidation. Four independent 16-bit ADCs provide precise and efficient management of multiple analog signals, which ultimately boosts system throughput. The new sigma-delta filter module (SDFM) works in conjunction with the sigma-delta modulator to enable isolated current shunt measurements. The Comparator Subsystem (CMPSS) with windowed comparators allows for protection of power stages when current limit conditions are exceeded or not met. Other analog and control peripherals include DACs, PWMs, eCAPs, eQEPs, and other peripherals.

Peripherals such as EMIFs, CAN modules (ISO 11898-1/CAN 2.0B-compliant), and a new uPP interface extend the connectivity of the F2837xD. The uPP interface is a new feature of the C2000™ MCUs and supports high-speed parallel connection to FPGAs or other processors with similar uPP interfaces. Lastly, a USB 2.0 port with MAC and PHY lets users easily add universal serial bus (USB) connectivity to their application.

Want to learn more about features that make C2000 MCUs the right choice for your real-time control system? Check out The Essential Guide for Developing With C2000™ Real-Time Microcontrollers and visit the C2000™ real-time control MCUs page.

The Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guide covers all aspects of development with C2000 devices from hardware to support resources. In addition to key reference documents, each section provides relevant links and resources to further expand on the information covered.

Ready to get started? Check out the TMDSCNCD28379D or LAUNCHXL-F28379D evaluation board sand download C2000Ware.

To learn more about the C2000 MCUs, visit the C2000 Overview at www.ti.com/c2000.

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Opciones de transportador

Puede elegir diferentes opciones de transportador según la cantidad de piezas, incluido carrete completo, carrete personalizado, cinta cortada, tubo o bandeja.

Un carrete personalizado es un trozo continuo de cinta cortada de un carrete para mantener la trazabilidad del código de lote y fecha, construido para la cantidad exacta solicitada. Siguiendo los estándares de la industria, una chapa de latón conecta una cabecera y cola de 18 pulgadas a ambos extremos de la cinta cortada para alimentar directamente las máquinas de ensamblaje automatizadas. TI incluye una tarifa de preparación de carretes para los pedidos de carretes personalizados.

La cinta cortada es un trozo de cinta cortada de un carrete. TI puede cumplir con los pedidos utilizando múltiples tiras de cintas cortadas o cajas para satisfacer la cantidad solicitada.

TI suele enviar los dispositivos de tubo o bandeja dentro de una caja o en el tubo o la bandeja, dependiendo de la disponibilidad de inventario. Embalamos todas las cintas, tubos o cajas de muestras de acuerdo con los requisitos de descarga electrostática interna y de protección del nivel de sensibilidad a la humedad.

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