パッケージ情報
| パッケージ | ピン数 HTSSOP (DAP) | 32 |
| 動作温度範囲 (℃) -40 to 125 |
| パッケージ数量 | キャリア 2,000 | LARGE T&R |
TPA3118D2-Q1 の特徴
- Supports Multiple Output Configurations
- 2 × 50 W Into a 4-Ω BTL Load at 21 V (TPA3116D2-Q1)
- 2 × 30 W Into an 8-Ω BTL Load at 24 V (TPA3118D2-Q1)
- Wide Voltage Range: 4.5 V to 26 V
- Efficient Class-D Operation
- >90% Power Efficiency Combined With Low Idle Loss Greatly Reduces Heat Sink Size
- Advanced Modulation Schemes
- Multiple Switching Frequencies
- AM Avoidance
- Master and Slave Synchronization
- Up to 1.2-MHz Switching Frequency
- Feedback Power-Stage Architecture With High PSRR Reduces PSU Requirements
- Programmable Power Limit
- Differential and Single-Ended Inputs
- Stereo BTL and Mono PBTL Modes
- Single Power Supply Reduces Component Count
- Integrated Self-Protection Circuits Including Overvoltage, Undervoltage, Overtemperature, DC-Detect, and Short Circuit With Error Reporting
- Designed for Automotive EMC Requirements
- Thermally Enhanced Packages
- DAD (32-pin HTSSOP Pad Up)
- DAP (32-pin HTSSOP Pad Down)
- –40°C to 125°C Ambient Temperature Range
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
- Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C4B
TPA3118D2-Q1 に関する概要
The TPA311xD2-Q1 devices are automotive stereo, efficient, digital-amplifier power stages for driving speakers up to 100 W into 2 Ω in mono. The TPA3118D2-Q1 can even drive 2 × 30 W into 8 Ω without a heat sink on a dual-layer PCB. If even higher power is needed, the TPA3116D2-Q1 drives 2 × 50 W into 4 Ω with a small heat sink attached to its top-side thermal pad.
The TPA311xD2-Q1 advanced oscillator and PLL circuit employ a multiple-switching-frequency option to avoid AM interference; this is achieved together with an option of either master or slave selection, making it possible to synchronize multiple devices.
The TPA311xD2-Q1 devices are fully protected against faults with short-circuit protection and thermal protection as well as overvoltage, undervoltage and dc protection. Faults are reported back to the processor to prevent devices from being damaged during overload conditions.