패키징 정보
| 패키지 | 핀 NFBGA (NZN) | 224 |
| 작동 온도 범위(°C) -40 to 85 |
| 패키지 수량 | 캐리어 1,000 | LARGE T&R |
CP3SP33의 주요 특징
- CPU Features
- Fully static RISC processor core,
capable of operating from 0 to 96 MHz
with zero wait/hold state - Minimum 10.4 ns instruction cycle time
with a 96-MHz internal clock frequency,
based on a 12-MHz external input - 4K-byte, 4-way set-associative
instruction cache - 69 independently vectored peripheral
interrupts
- Fully static RISC processor core,
- DSP Features
- Capable of operating up to 96 MHz
- 16-bit fixed-point arithmetic, dual-MAC
architecture - 32-bit interface to 4K-byte RAM shared with
CPU - 32-bit external bus interface
- Bus master interface to audio peripherals
and I/O
- Memory
- 4K bytes CPU instructioncache
- 32K bytes CPU data RAM
- 4K bytes CPU/DSP shared RAM
- 24K bytes DSP program RAM
- 24K bytes DSP data RAM
- 8K bytes Bluetooth sequencer and data RAM
- Addresses up to 96M bytes (FBGA-224 package)
or 8M bytes (FBGA-144 package) of external
memory
- Broad Range of Hardware Communications Peripherals
- Bluetooth Lower Link Controller (LLC)
including a shared 7K byte Bluetooth data
RAM and 1K byte Bluetooth Sequencer RAM - Universal Serial Bus (USB) 2.0 On-The-Go
- Audio/telematics codec with dual ADC inputs
and high quality stereo DAC output - Two CAN interfaces with 15 message buffers
conforming to CAN specification 2.0B active - Two ACCESS.bus serial bus interfaces (I2C compatible)
- Two 8/16-bit SPI, Microwire/Plus serial interfaces
- I2S digital audio bus interface
- Four Universal Asynchronous Receiver/Transmitter (UART)
channels, one channel has USART capability - Advanced Audio Interface (AAI) to connect to external
8/ 13-bit PCM Codecs as well as to ISDN-Controllers
through the IOM-2 interface (slave only) - Two CVSD/PCM converters, for supporting two bidirectional
audio connections
- Bluetooth Lower Link Controller (LLC)
- External Bus Interface Shared Between CPU and DSP
- 16/32-bit data busbus interface
- 23-bit address bus
- 3 programmable chip select outputs
- Up to 96M bytes external memory
- 8-level write buffer
- General-Purpose Hardware Peripherals
- 10-channel, 10-bit A/D Converter (ADC)
- 16-channel DMA controller
- Dual 16-bit Multi-Function Timer (MFT)
- Dual Versatile Timer Units (VTU), each with four
independent timers - Timing and Watchdog Unit
- Extensive Power and Clock Management Support
- Two Phase Locked Loops (PLL) for synthesizing independent
system and audio peripheral clocks - Two independent oscillators for Active mode
(12 MHz) and Power Save mode (32.768 kHz) clocks - Low-power modes (Power Save, Idle, and Halt) for
slowing or stopping clocks to optimize power
consumption while meeting application needs
- Two Phase Locked Loops (PLL) for synthesizing independent
- Flexible I/O
- Up to 64 general-purpose I/O pins (shared with on-chip
peripheral I/O) - Programmable I/O pin characteristics: TRI-STATE output,
push-pull output, weak pullup/pulldown input, high
impedance input, high-speed drive capability - Schmitt triggers on general-purpose inputs
- Multi-Input Wake-Up (MIWU) capability…
- Up to 64 general-purpose I/O pins (shared with on-chip
- Power Supply
- I/O port operation at 3.0–3.3V
- Core logic operation at 1.8V
- On-chip power-on reset
- Temperature Range
- –40°C to +85°C (Industrial)
- Packages
- FBGA-224, FBGA-144
- Complete Development Environment
- Pre-integrated hardware and software support for
rapid prototyping and production - Multi-file C source editor, source debugger,
and project manager - Comprehensive, integrated, one-stop technical support
- Pre-integrated hardware and software support for
- Bluetooth Protocol Stack
- Applications can interface to the high-level
protocols or directly to the low-level Host
Controller Interface (HCI) - Transport layer support allows HCI command-based
interface over UART port - Baseband (Link Controller) hardware minimizes
the bandwidth demand on the CPU - Link Manager (LM)
- Logical Link Control and Adaptation Protocol
(L2CAP) - Service Discovery Protocol (SDP)
- RFCOMM Serial Port Emulation Protocol
- All packet types, piconet, and scatternet
functionality
- Applications can interface to the high-level
CP3SP33에 대한 설명
The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.
On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.
In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.
National Semiconductor offers a complete and industry proven application development environment for CP3SP33 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth protocol stack, and application examples.