평가 모듈(EVM)용 GUI
LDC1041
- Remote sensor placement (decoupling the LDC from
harsh environments) - High durability (by virtue of contactless operation)
- Higher flexibility for system design (using coils or
springs as sensors) - Insensitive to non-conductive environmental interferers
(such as dirt, dust, oil etc.) - Magnet-free operation
- Sub-micron precision
- Supply Voltage: 5 V, typ
- Supply voltage, IO: 1.8V to 5.5V
- Stand-by current: 250µA, typ
- Rp resolution: 8-bit
- L resolution: 24-bit
- LC frequency range: 5kHz to 5MHz
Inductive sensing is a contactless, short-range sensing technology enabling high-resolution and low-cost position sensing of conductive targets, even in harsh environments. Using a coil or spring as a sensor, the LDC1041 inductance-to-digital converter provides system designers a way to achieve high performance and reliability at a lower system cost than other competing solutions.
The LDC1041 is pin compatible with the LDC1000 (16-bit Rp/24-bit L) and the LDC1051 (8-bit Rp). This family of devices offers system designers different resolution options based on their application and system requirements.
The LDC1041 is available in a 5mm x 4mm WSON-16 package. Device programming via SPI allows for easy configuration using a microcontroller.
기술 자료
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
12개 모두 보기 설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
계산 툴
LDC-CALCULATOR-TOOLS — Inductive Sensing Design Calculator Tool
The inductive sensing calculator tools provide two Excel spreadsheets to assist in the design process for inductive-to-digital converter (LDC) devices. These tools provide coil design assistance as well as some device-specific configurations.
지원되는 제품 및 하드웨어
제품
유도성 센서 AFE
하드웨어 개발
평가 보드
레퍼런스 디자인
TIDA-00215 — 유도성 센서를 사용한 거리 및 무게 측정 레퍼런스 디자인
The Distance and Weight Measurement Using Inductive Sensing Reference Design is a sub-system design which converts a distance measurement to a weight measurement. This design is intended as a reference design for building automation and weigh scale applications. In mechanical systems, there (...)
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| WSON (NHR) | 16 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.