SN74ABT125Q-Q1

활성

TTL 호환 CMOS 입력 및 3상 출력을 지원하는 오토모티브 4채널, 4.5V~5.5V 버퍼

제품 상세 정보

Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 4 IOL (max) (mA) 32 Supply current (max) (µA) 30000 IOH (max) (mA) -16 Input type TTL-Compatible CMOS Output type 3-State Features Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Automotive Operating temperature range (°C) -40 to 125
Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 4 IOL (max) (mA) 32 Supply current (max) (µA) 30000 IOH (max) (mA) -16 Input type TTL-Compatible CMOS Output type 3-State Features Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Automotive Operating temperature range (°C) -40 to 125
SOIC (D) 14 51.9 mm² 8.65 x 6
  • Qualified for Automotive Applications
  • Typical VOLP (Output Ground Bounce)
       <1 V at VCC = 5 V, TA = 25°C
  • High-Drive Outputs
       (–16-mA IOH, 32-mA IOL)
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

  • Qualified for Automotive Applications
  • Typical VOLP (Output Ground Bounce)
       <1 V at VCC = 5 V, TA = 25°C
  • High-Drive Outputs
       (–16-mA IOH, 32-mA IOL)
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

The SN74ABT125Q-Q1 quadruple bus buffer gate features independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is high.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74ABT125Q-Q1 quadruple bus buffer gate features independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is high.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치보다 업그레이드된 기능을 지원하는 즉각적 대체품
SN74AHCT125-Q1 활성 TTL 호환 CMOS 입력 및 3상 출력을 지원하는 오토모티브 4채널, 4.5V~5.5V 버퍼 Larger voltage range (2V to 5.5V)
비교 대상 장치와 유사한 기능
SN74LVC125A-Q1 활성 3상 출력을 지원하는 오토모티브 4채널 1.65V~3.6V 버퍼 Lower average drive strength (24mA), longer average propagation delay (5.5ns)

기술 문서

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모두 보기20
유형 직함 날짜
* Data sheet Quadruple Bus Buffer Gate With 3-State Outputs datasheet (Rev. B) 2008/01/18
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
More literature Automotive Logic Devices Brochure 2014/08/27
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 2004/02/16
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 1997/03/01
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 1996/12/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

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평가 보드

14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈

14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.

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패키지 다운로드
SOIC (D) 14 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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