홈 로직 및 전압 변환 버퍼, 드라이버 및 트랜시버 범용 트랜시버
홈
로직 및 전압 변환
버퍼, 드라이버 및 트랜시버
범용 트랜시버

SN74LVT16501

활성

3상 출력을 지원하는 3.3V ABT 18비트 범용 버스 트랜시버

지금 주문
데이터 시트

SN74LVT16501

활성
데이터 시트 지금 주문

제품 상세 정보

Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -15 Input type TTL-Compatible CMOS Output type 3-State Features Very high speed (tpd 5-10ns) Technology family LVT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -15 Input type TTL-Compatible CMOS Output type 3-State Features Very high speed (tpd 5-10ns) Technology family LVT Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
  • Members of the Texas Instruments WidebusTM Family
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Support Live Insertion
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

 

Widebus and UBT are trademarks of Texas Instruments Incorporated.
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
  • Members of the Texas Instruments WidebusTM Family
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Support Live Insertion
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

 

Widebus and UBT are trademarks of Texas Instruments Incorporated.

The 'LVT16501 are 18-bit universal bus transceivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

Data flow in each direction is controlled by output-enable (OEAB and ), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A-bus data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

 

Data flow for B to A is similar to that of A to B but uses , LEBA, and CLKBA. The output enables are complementary (OEAB is active high and is active low).

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor. The minimum value of the resistor is determined by the current-sinking capability of the driver. OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The SN74LVT16501 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the input/output (I/O) pin count and functionality of standard small-outline packages in the same printed circuit board area.

The SN54LVT16501 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT16501 is characterized for operation from -40°C to 85°C.

 

 

 

The 'LVT16501 are 18-bit universal bus transceivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

Data flow in each direction is controlled by output-enable (OEAB and ), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A-bus data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

 

Data flow for B to A is similar to that of A to B but uses , LEBA, and CLKBA. The output enables are complementary (OEAB is active high and is active low).

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor. The minimum value of the resistor is determined by the current-sinking capability of the driver. OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The SN74LVT16501 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the input/output (I/O) pin count and functionality of standard small-outline packages in the same printed circuit board area.

The SN54LVT16501 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT16501 is characterized for operation from -40°C to 85°C.

 

 

 
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기술 자료

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16개 모두 보기
유형 직함 날짜
* Data sheet 3.3-V ABT 18-Bit Universal Bus Transceivers With 3-State Outputs datasheet (Rev. G) 1996/11/01
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09
Application note LVT-to-LVTH Conversion 1998/12/08
Application note LVT Family Characteristics (Rev. A) 1998/03/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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