패키징 정보
| 패키지 | 핀 SOT-23 (DBV) | 5 |
| 작동 온도 범위(°C) -40 to 125 |
| 패키지 수량 | 캐리어 3,000 | LARGE T&R |
TLV755P의 주요 특징
- SOT-23-5 package with 60.3°C/W RθJA available
- Input voltage range: 1.45V to 5.5V
- Low IQ: 25µA (typical)
- Low dropout:
- 238mV (maximum) at 500mA (3.3VOUT)
- Output accuracy: 1% (maximum at 85°C)
- Built-in soft-start with monotonic VOUT rise
- Foldback current limit
- Active output discharge
- High PSRR: 46dB at 100kHz
- Stable with a 1µF ceramic output capacitor
- Packages:
- 2.9mm × 2.8mm SOT-23-5 (DBV)
- 2.9mm × 2.8mm SOT-23-5 (DYD) with thermal pad
- 1mm × 1mm X2SON-4 (DQN)
- 2mm × 2mm WSON-6 (DRV)
TLV755P에 대한 설명
The TLV755P is an ultra-small, low quiescent current, low-dropout regulator (LDO) that sources 500mA with good line and load transient performance. The TLV755P is optimized for a wide variety of applications by supporting an input voltage range from 1.45V to 5.5V. To minimize cost and solution size, the device is offered in fixed output voltages ranging from 0.6V to 5V to support the lower core voltages of modern microcontrollers (MCUs). Additionally, the TLV755P has a low IQ with enable functionality to minimize standby power. This device features an internal soft-start to lower inrush current, thus providing a controlled voltage to the load and minimizing the input voltage drop during start up. When shutdown, the device actively pulls down the output to quickly discharge the outputs and provide a known start-up state.
The TLV755P is stable with small ceramic output capacitors allowing for a small overall solution size. A precision band-gap and error amplifier provides a typical accuracy of 1%. All device versions have integrated thermal shutdown, current limit, and undervoltage lockout (UVLO). The TLV755P has an internal foldback current limit that helps reduce the thermal dissipation during short-circuit events.
The TLV755 is available in the popular WSON, X2SON, and SOT23-5 (DRV, DQN, and DBV) packages. This device is also available in a thermally enhanced SOT23-5 (DYD) package with a thermal pad that provides significantly reduced thermal resistance compared to a standard SOT23-5 package.