ADS5500
- 14-Bit Resolution
- 125 Msps Sample Rate
- High SNR: 71.2 dBFS at 100-MHz fIN
- High SFDR: 82 dBc at 100-MHz fIN
- 2.3-VPP Differential Input Voltage
- Internal Voltage Reference
- 3.3-V Single-Supply Voltage
- Analog Power Dissipation: 578 mW
- Serial Programming Interface
- TQFP-64 PowerPAD™ Package
- Recommended Amplifiers: OPA695, OPA847, THS3201, THS3202, THS4503, THS4509, THS9001
- APPLICATIONS
- Wireless Communication
- Communication Receivers
- Base Station Infrastructure
- Test and Measurement Instrumentation
- Single and Multichannel Digital Receivers
- Communication Instrumentation
- Radar, Infrared
- Video and Imaging
- Medical Equipment
- Wireless Communication
PowerPAD is a trademark of Texas Instruments.
The ADS5500 is a high-performance, 14-bit, 125 Msps analog-to-digital converter (ADC). To provide a complete converter solution, it includes a high-bandwidth linear sample-and-hold stage (S&H) and internal reference. Designed for applications demanding the highest speed and highest dynamic performance in little space, the ADS5500 has excellent power consumption of 578 mW at 3.3-V single-supply voltage. This allows an even higher system integration density. The provided internal reference simplifies system design requirements. Parallel CMOS-compatible output ensures seamless interfacing with common logic.
The ADS5500 is available in a 64-pin TQFP PowerPAD package and in both a commercial and industrial temperature grade device.
技術文件
設計與開發
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支援產品和硬體
JITTER-SNR-CALC — Jitter and SNR calculator
JITTER-SNR-CALC can be used for calculating theoretical Signal to Noise (SNR) performance of ADCs based on input frequency and clock jitter.
支援產品和硬體
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HTQFP (PAP) | 64 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。