ADS7828
- 8-CHANNEL MULTIPLEXER
- 50kHz SAMPLING RATE
- NO MISSING CODES
- 2.7V TO 5V OPERATION
- INTERNAL 2.5V REFERENCE
- I2C INTERFACE SUPPORTS:
Standard, Fast, and High-Speed Modes - TSSOP-16 PACKAGE
- APPLICATIONS
- VOLTAGE-SUPPLY MONITORING
- ISOLATED DATA ACQUISITION
- TRANSDUCER INTERFACES
- BATTERY-OPERATED SYSTEMS
- REMOTE DATA ACQUISITION
I2C is a trademark of Koninklijke Philps Electronics N.V. All other trademarks are the property of their respective owners.
The ADS7828 is a single-supply, low-power, 12-bit data acquisition device that features a serial I2C interface and an 8-channel multiplexer. The Analog-to-Digital (A/D) converter features a sample-and-hold amplifier and internal, asynchronous clock. The combination of an I2C serial, 2-wire interface and micropower consumption makes the ADS7828 ideal for applications requiring the A/D converter to be close to the input source in remote locations and for applications requiring isolation. The ADS7828 is available in a TSSOP-16 package.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 12-Bit, 8-Channel Sampling Analog-to-Digital Converter with I2C Interface datasheet (Rev. C) | 2005年 3月 30日 | |
Application note | A Basic Guide to I2C | PDF | HTML | 2022年 11月 8日 | |
E-book | Best of Baker's Best: Precision Data Converters -- SAR ADCs | 2015年 5月 21日 | ||
Application note | Determining Minimum Acquisition Times for SAR ADCs, part 2 | 2011年 3月 17日 | ||
Application note | Determining Minimum Acquisition Times for SAR ADCs, part 1 (Rev. A) | 2010年 11月 10日 | ||
EVM User's guide | ADS7823-28EVM | 2004年 6月 16日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
ADS7823-28EVM — ADS7823 和 ADS7828 評估模組
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ADS7828SW-LINUX — 適用於 ADS7828 的 Linux 驅動程式
Linux Mainline Status
Available in Linux Main line: Yes
Available through git.ti.com: N/A
Supported Devices:
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一般用途運算放大器
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功率運算放大器
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生物感測 AFE
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晶粒與晶圓服務
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。