BQ77205
- 3-series cell to 5-series cell protection
- High-accuracy overvoltage protection
- ±10 mV at 25°C
- ±20 mV from 0°C to 60°C
- Overvoltage protection options from 3.55 V to 5.1 V
- Open-wire connection detection
- Random cell connection
- Functional safety-capable
- Fixed internal delay timers
- Fixed detection thresholds
- Fixed output drive type
- Active high or active low
- Active high drive to 6 V
- Open drain with the ability to be pulled up externally to VDD
- Low power consumption I CC ≈ 1 µA (V CELL(ALL) < V OV)
- Low leakage current per cell input < 100 nA with open wire detection disabled
- Package footprint options:
- 8-pin DGK with 0.65-mm lead pitch
The BQ77205 family of products provides a range of voltage and temperature monitoring, including overvoltage protection (OVP) and open-wire (OW) protection for Li-ion battery pack systems. Each cell is monitored independently for overvoltage and open-wire conditions.
In the BQ77205 device, an internal delay timer is initiated upon detection of an overvoltage, open-wire condition. Upon expiration of the delay timer, the respective output is triggered into its active state (either high or low, depending on the configuration).
The overvoltage triggers the OUT pin if a fault is detected. If an open-wire fault is detected, then the OUT is triggered. For quicker production-line testing, the BQ77205 device provides a Customer Test Mode (CTM) with significantly reduced delay time.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | BQ77205 Overvoltage Protection for 3-Series to 5-Series Cell Li-Ion Batteries with Internal Delay Timer datasheet | PDF | HTML | 2023年 10月 4日 |
設計與開發
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BQ77207EVM — BQ77207 評估模組，3 串聯至 7 串聯電池芯鋰離子電池電壓和溫度保護器
BQ77207EVM 評估模組 (EVM) 是適用於 BQ77207 的完整評估系統，其為 3 串聯至 7 串聯電池芯鋰離子電池保護積體電路。此電路模組包含一個 BQ77207 積體電路 (IC)、熱敏電阻和所有其他必要的板載元件，以在 7 串聯電池芯鋰離子或鋰聚合物電池組中發出過度充電、過度放電和過熱訊號。
| 封裝 | 引腳 | 下載 |
|---|---|---|
| VSSOP (DGK) | 8 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。