CD54ACT273
- Buffered Inputs
- Typical Propagation Delay
- 6.5ns at VCC = 5V, TA = 25°C, CL = 50pF
- Exceeds 2kV ESD Protection MIL-STD-883, Method 3015
- SCR-Latchup-Resistant CMOS Process and Circuit Design
- Speed of Bipolar FAST™/AS/S with Significantly Reduced Power Consumption
- Balanced Propagation Delays
- AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply
- ±24mA Output Drive Current
- Fanout to 15 FAST™ ICs
- Drives 50 Transmission Lines
Data sheet acquired from Harris Semiconductor
FAST™ is a Trademark of Fairchild Semiconductor.
The AC273 and ACT273 devices are octal D-type flip-flops with reset that utilize advanced CMOS logic technology. Information at the D input is transferred to the Q output on the positive-going edge of the clock pulse. All eight flip-flops are controlled by a common clock (CP) and a common reset (MR)\. Resetting is accomplished by a low voltage level independent of the clock.
技術文件
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檢視所有 12 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Octal D Flip-Flop with Reset datasheet (Rev. B) | 2002年 7月 1日 | |
Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |
Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021年 7月 26日 | ||
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004年 6月 22日 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997年 6月 1日 | ||
Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996年 4月 1日 |
設計與開發
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訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點