產品詳細資料

Technology family HC Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 5.2 IOH (max) (mA) -5.2 Supply current (max) (µA) 40 Input type TTL-Compatible CMOS Output type Push-Pull Features Balanced outputs, High speed (tpd 10-50ns), Input clamp diode, Unbuffered Rating Automotive Operating temperature range (°C) -40 to 125
Technology family HC Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 5.2 IOH (max) (mA) -5.2 Supply current (max) (µA) 40 Input type TTL-Compatible CMOS Output type Push-Pull Features Balanced outputs, High speed (tpd 10-50ns), Input clamp diode, Unbuffered Rating Automotive Operating temperature range (°C) -40 to 125
TSSOP (PW) 14 32 mm² 5 x 6.4
  • AEC-Q100 Qualified for automotive applications:
    • Device temperature grade 1: –40°C to +125°C, TA
  • Qualified for automotive applications
  • Unbuffered logic
  • Positive and negative input clamp diodes
  • Wide operating voltage range: 2 V to 6 V
  • Significant power reduction compared to LSTTL logic ICs
  • AEC-Q100 Qualified for automotive applications:
    • Device temperature grade 1: –40°C to +125°C, TA
  • Qualified for automotive applications
  • Unbuffered logic
  • Positive and negative input clamp diodes
  • Wide operating voltage range: 2 V to 6 V
  • Significant power reduction compared to LSTTL logic ICs

The CD74HCU04-Q1 device contains six independent high-speed CMOS unbuffered inverters. Each inverter performs the Boolean function Y = A in positive logic.

The CD74HCU04-Q1 device contains six independent high-speed CMOS unbuffered inverters. Each inverter performs the Boolean function Y = A in positive logic.

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SN74AHC04-Q1 現行 車用 6 通道、2-V 至 5.5-V 逆變器 Voltage range (2V to 5.5V), average drive strength (9mA), average propagation delay (12ns)

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類型 標題 日期
* Data sheet CD74HCU04-Q1 Automotive Qualified Hex Unbuffered Inverter datasheet (Rev. A) 2020年 4月 8日

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內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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