ESD341
- IEC 61000-4-2 level 4 ESD protection
- 30 kV contact discharge
- 30 kV air gap discharge
- IEC 61000-4-5 surge protection
- 5.4 A (8/20 µs)
- IO capacitance:
- 0.66 pF (typical)
- DC breakdown voltage: ±6.2 V (typical)
- Ultra low leakage current: 100 nA (maximum)
- Low ESD clamping voltage: 10.2 V at 16 A TLP
- Low insertion loss: 5 GHz (–3 dB bandwidth, DPL)
- Supports high speed interfaces up to 3.4 Gbps
- Industrial temperature range: –40°C to +125°C
- Space-saving industry standard 0201 footprint (0.6 mm × 0.3 mm × 0.3 mm)
The ESD341 is a bidirectional TVS ESD protection diode for HDMI 1.4 circuit protection. The ESD341 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).
This device features a 0.66 pF (typical) IO capacitance enabling high-speed interface protection up to 3.4 Gbps including support for protocols such as HDMI 1.4b. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.
The 30 kV ESD rating and 5.4 A surge provides robust transient protection in a tiny package for protecting 3.6 V power rails in portable electronics and other space constrained applications such as wearables.
The ESD341 is offered in the industry standard 0201 (DPL) package.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | ESD341 1-Channel ± 30 kV ESD Protection Diode in 0201 Package datasheet (Rev. A) | PDF | HTML | 2022年 7月 19日 |
| Application note | ESD and Surge Protection for USB Interfaces (Rev. B) | PDF | HTML | 2024年 1月 11日 | |
| Application brief | ESD Protection for HDMI Applications (Rev. A) | PDF | HTML | 2023年 11月 1日 | |
| Product overview | Isolated USB Repeater (Rev. B) | PDF | HTML | 2023年 8月 22日 | |
| Selection guide | System-Level ESD Protection Guide (Rev. D) | 2022年 9月 7日 | ||
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 | |
| Analog Design Journal | Design Considerations for System-Level ESD Circuit Protection | 2012年 9月 25日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
ESDEVM — ESD 評估模組
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| X2SON (DPL) | 2 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。