LMP93601
- High Gain, Programmable up to 4096
- Low Gain Error Drift, <10 ppm/°C
- Low Offset Voltage and Drift; 1 µV, 50 nV/°C
- Low Input Bias Current, 1.3 nA
- Low Input Offset Current, 120 pA
- VCM Output Signal for Level Shifting, AVDD/3
- Three Differential EMI Hardened Inputs
- 16-bit ΔΣ Analog-to-Digital Converter
- Low Noise Performance, ENOB 15.3 bits
- Four Output Data Rates, up to 1.3 kSPS
- Internal Voltage Reference for ADC
- SPI Interface Transfer Rate, 20 MHz
- Brown-Out Detect
- PGA Over-Range Detect
- Separate Analog and Digital Supplies, 2.7 to 5.5 V
- Low Current Consumption, 1.1 mA
- Low Power Shutdown Mode, < 0.1µA
- Operating Temp. –25 to 85 °C
The LMP93601 is an optimized Analog-Front-End (AFE) for occupancy detecting thermopile arrays up to 16 x 16 and thermopile mass flow sensors. The AFE combines excellent noise performance, low offset voltage, high gain, and low-power consumption at sampling rates ideal for monitoring thermopile sensors.
The LMP93601 is a precision, 16-bit, analog-to-digital converter (ADC) offered in a leadless WQFN-24 package. The device features three differential EMI hardened inputs, a low-noise, high-gain programmable gain amplifier (PGA), a level shifting voltage source, an internal reference, and a programmable sampling rate. The many integrated features and the simple control of the LMP93601 through an SPI-compatible interface ease precision measurements of thermopile sensor signals.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | LMP93601 Low-Noise, High Gain, 3-Channel AFE for Thermopile Sensors datasheet (Rev. A) | PDF | HTML | 2014年 9月 30日 |
設計與開發
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LMP93601EVM — LMP93601 熱電堆感測器介面評估模組
LMP93601EVM 為一款針對 LMP93601 之示範套件,該 LMP93601 為一款三通道類比前端 (AFE),內含 16 位元高效能低雜訊 ΔΣ 轉換器 (ADC) 及高增益放大級。LMP93601EVM 配備 MSP430F5529 微控制器,提供使用者評估 AFE 各項功能所需的完整電路。該開發板可搭配各類熱電堆佔用偵測陣列、熱電堆流量感測器,以及以橋接配置連接之各種轉換器。 該開發板透過 USB 介面連接至主機電腦 (PC)。可於德州儀器官網取得圖形使用者介面 (GUI) 軟體,供該評估平台在個人電腦上執行。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| WQFN (NHZ) | 24 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。