72-pin (RLG) package image

LMZ31520RLGT 現行

採用 15x16x5.8mm QFN 封裝的 3V 至 14.5V、20A 降壓電源模組

open-in-new 檢視替代方案

定價

數量 價格
+

品質資訊

等級 Catalog
RoHS 豁免
REACH 受影響
引腳鍍層 / 焊球材質 NIPDAU
MSL 等級 / 迴焊峰值 Level-3-245C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:EAR99

封裝資訊

封裝 | 引腳 B4QFN (RLG) | 72
作業溫度範圍 (°C) -40 to 85
包裝數量 | 運送包裝 250 | SMALL T&R

LMZ31520 的特色

  • Complete Integrated Power Solution;
    Smaller than a Discrete Design
  • 15 mm × 16 mm × 5.8 mm Package Size
    - Pin Compatible with LMZ31530
  • Ultra-Fast Load Step Response
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.6 V to 3.6 V, with 1% Reference Accuracy
  • Optional Split Power Rails Allows
    Input Voltage Down to 3 V
  • Selectable Switching Frequency
    (300 kHz to 850 kHz)
  • Selectable Slow-Start
  • Adjustable Overcurrent Limit
  • Power Good Output
  • Output Voltage Sequencing
  • Over Temperature Protection
  • Pre-bias Output Start-up
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 8.6°C/W
  • Meets EN55022 Class A Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ31520 With the WEBENCH® Power Designer

LMZ31520 的說明

The LMZ31520 power module is an easy-to-use integrated power solution that combines a 20-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 15×16×5.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast load step response and excellent power dissipation capability with a thermal impedance of 8.6°C/W. The LMZ31520 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解