SMV512K32-SP
- 20-ns Read, 13.8-ns Write Through Maximum Access Time
- Functionally Compatible With Commercial
512K x 32 SRAM Devices - Built-In EDAC (Error Detection and Correction) to Mitigate Soft Errors
- Built-In Scrub Engine for Autonomous Correction
- CMOS Compatible Input and Output Level, Three State Bidirectional
Data Bus- 3.3 ±0.3-V I/O, 1.8 ±0.15-V CORE
- Radiation Performance(1)
- Uses Both Substrate Engineering and Radiation Hardened by Design (HBD)(2)
- TID Immunity > 3e5 rad (Si)
- SER < 5e-17 Upsets/Bit-Day (Core Using EDAC and Scrub)(3)
- Latch up immunity > LET = 110 MeV (T = 398K)
(1) Radiation tolerance is a typical value based upon initial device qualification. Radiation Data and Lot Acceptance Testing is available – contact factory for details.
(2) HardSIL™ technology and memory design under a license agreement with Silicon Space Technology (SST).
(3) SER calculated using CREME96 for geosynchronous orbit,
solar minimum.
(4) These units are intended for engineering evaluation only. They are processed to a non-compliant flow (e.g. no burn-in, etc.) and are tested to temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warranted for performance on full MIL specified temperature range of –55°C to 125°C or operating life.
The SMV512K32 is a high performance asynchronous CMOS SRAM organized as 524,288 words by 32 bits. It is pin selectable between two modes: master or slave. The master device selection provides user defined autonomous EDAC scrubbing options. The slave device selection employs a scrub on demand feature that can be initiated by a master device. Three read cycles and four write cycles (described below) are available depending on the user needs.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 16-Mb Radiation-Hardened SRAM datasheet (Rev. I) | 2014年 1月 2日 | |
* | SMD | SMV512K32-SP SMD 5962-11237 | 2016年 7月 8日 | |
More literature | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. B) | 2025年 2月 20日 | ||
Selection guide | TI Space Products (Rev. J) | 2024年 2月 12日 | ||
Application note | Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) | PDF | HTML | 2022年 11月 17日 | |
Application note | Single-Event Effects Confidence Interval Calculations (Rev. A) | PDF | HTML | 2022年 10月 19日 | |
Application note | 16 MB Radiation-Hardened SRAM with EDAC to Mitigate Soft Errors (Rev. A) | 2019年 8月 2日 | ||
E-book | Radiation Handbook for Electronics (Rev. A) | 2019年 5月 21日 | ||
User guide | SMV512K32-CVAL User Guide | 2012年 1月 12日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CFP (HFG) | 76 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點