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SN54AHC244-SP

現行

具 3 態輸出的航太 8 通道 2-V 至 5.5-V 緩衝器

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產品規格表

SN54AHC244-SP

現行
產品規格表 立即訂購

產品詳細資料

Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 8 Supply current (max) (µA) 40 IOH (max) (mA) -8 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Space Operating temperature range (°C) -55 to 125
Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 8 Supply current (max) (µA) 40 IOH (max) (mA) -8 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Space Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92
  • VCC operating range of 2V to 5.5V
  • Latch-up performance exceeds 250mA per JESD 17
  • On products compliant to MIL-PRF-38535, All parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
  • VCC operating range of 2V to 5.5V
  • Latch-up performance exceeds 250mA per JESD 17
  • On products compliant to MIL-PRF-38535, All parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

These octal buffers and drivers are designed specifically to improve the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

These octal buffers and drivers are designed specifically to improve the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
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* Data sheet SNx4AHC244 Octal Buffers/Drivers With 3-State Outputs datasheet (Rev. N) PDF | HTML 2025年 6月 19日

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  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

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