產品詳細資料

Technology family ALVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 12 Supply current (max) (µA) 40 IOH (max) (mA) -12 Input type Standard CMOS Output type 3-State Features Balanced outputs, Bus-hold, Damping resistors, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ALVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 12 Supply current (max) (µA) 40 IOH (max) (mA) -12 Input type Standard CMOS Output type 3-State Features Balanced outputs, Bus-hold, Damping resistors, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1
  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • Output Ports Have Equivalent 26- Series Resistors, So No External Resistors Are Required
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages

NOTE: For tape-and-reel order entry, the DGGR package is abbreviated to GR.

Widebus, EPIC are trademarks of Texas Instruments.

  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • Output Ports Have Equivalent 26- Series Resistors, So No External Resistors Are Required
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages

NOTE: For tape-and-reel order entry, the DGGR package is abbreviated to GR.

Widebus, EPIC are trademarks of Texas Instruments.

This 16-bit buffer/driver is designed for 1.65-V to 3.6-V VCC operation.

The SN74ALVCH162244 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and symmetrical active-low output-enable (OE)\ inputs.

The outputs, which are designed to sink up to 12 mA, include equivalent 26- resistors to reduce overshoot and undershoot.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVCH162244 is characterized for operation from –40°C to 85°C.

This 16-bit buffer/driver is designed for 1.65-V to 3.6-V VCC operation.

The SN74ALVCH162244 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and symmetrical active-low output-enable (OE)\ inputs.

The outputs, which are designed to sink up to 12 mA, include equivalent 26- resistors to reduce overshoot and undershoot.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVCH162244 is characterized for operation from –40°C to 85°C.

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技術文件

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類型 標題 日期
* Data sheet SN74ALVCH162244 datasheet (Rev. F) 2004年 9月 7日
Application note An Overview of Bus-Hold Circuit and the Applications (Rev. B) 2018年 9月 17日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
User guide ALVC Advanced Low-Voltage CMOS Including SSTL, HSTL, And ALB (Rev. B) 2002年 8月 1日
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002年 6月 13日
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002年 5月 22日
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999年 9月 8日
Application note TI SN74ALVC16835 Component Specification Analysis for PC100 1998年 8月 3日
Application note Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A) 1998年 5月 13日
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997年 12月 1日
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
Application note Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
Application note Live Insertion 1996年 10月 1日
Application note Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日

設計與開發

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模擬型號

SN74ALVCH162244 Behavioral SPICE Model

SCEM760.ZIP (7 KB) - PSpice Model
模擬型號

SN74ALVCH162244 IBIS Model (Rev. A)

SCEM160A.ZIP (57 KB) - IBIS Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian

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內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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