SN74F245
- 3-State Outputs Drive Bus Lines Directly
- Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
These octal bus transceivers are designed for asynchronous
communication between data buses. The devices transmit data from the
A bus to the B bus or from the B bus to the A bus depending upon the
logic level at the direction-control (DIR) input. The output enable
input can be
used to disable the device so the buses are effectively isolated.
The SN74F245 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F245 is characterized for operation from 0°C to 70°C.
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技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | Octal Bus Transceivers With 3-State Outputs datasheet (Rev. A) | 1993年 10月 1日 | |
| Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997年 8月 1日 | ||
| Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 |
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