SN74LV1T34-Q1
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AEC-Q100 qualified for automotive applications:
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Device temperature grade 1: -40°C to +125°C
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Device HBM ESD classification level 2
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Device CDM ESD classification level C4B
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Wide operating range of 1.8 V to 5.5 V
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Single-supply voltage translator (refer to LVxT Enhanced Input Voltage):
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Up translation:
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1.2 V to 1.8 V
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1.5 V to 2.5 V
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1.8 V to 3.3 V
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3.3 V to 5.0 V
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Down translation:
- 5.0 V, 3.3 V, 2.5 V to 1.8 V
- 5.0 V, 3.3 V to 2.5 V
- 5.0 V to 3.3 V
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- 5.5 V tolerant input pins
- Supports standard pinouts
- Up to 150 Mbps with 5 V or 3.3 V V CC
- Latch-up performance exceeds 250 mA per JESD 17
The SN74LV1T34-Q1 contains a single buffer with extended voltage operation to allow for level translation. The buffer performs the Boolean function Y = A in positive logic. The output level is referenced to the supply voltage (V CC) and supports 1.8-V, 2.5-V, 3.3-V, and 5-V CMOS levels.
The input is designed with a lower threshold circuit to support up translation for lower voltage CMOS inputs (for example 1.2 V input to 1.8 V output or 1.8 V input to 3.3 V output). Additionally, the 5-V tolerant input pins enable down translation (for example 3.3 V to 2.5 V output).
技術文件
類型 | 標題 | 日期 | ||
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* | Data sheet | SN74LV1T34-Q1Automotive Single Power Supply Single Buffer Logic Level Shifter datasheet (Rev. B) | PDF | HTML | 2023年 11月 14日 |
Application note | Schematic Checklist - A Guide to Designing With Fixed or Direction Control Translators | PDF | HTML | 2024年 10月 2日 | |
Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024年 7月 12日 | |
Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024年 7月 3日 |
設計與開發
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5-8-LOGIC-EVM — 適用於 5 針腳至 8 針腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模組
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點