SN74LV8T273
- Wide operating range of 1.65V to 5.5V
- 5.5V tolerant input pins
- Single-supply voltage translator (refer to LVxT Enhanced Input Voltage):
- Up translation:
- 1.2V to 1.8V
- 1.5V to 2.5V
- 1.8V to 3.3V
- 3.3V to 5.0V
-
Down translation:
- 5.0V, 3.3V, 2.5V to 1.8V
- 5.0V, 3.3V to 2.5V
- 5.0V to 3.3V
- Up translation:
- Up to 150Mbps with 5V or 3.3V VCC
- Supports standard function pinout
- Latch-up performance exceeds 250mAper JESD 17
The SN74LV8T273 contains eight positive-edge-triggered D-type flip-flops with a direct active low clear (CLR) input.
Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When CLK is at either the high or low level, the D input has no effect at the output.
The input is designed with a reduced threshold circuit to support up translation when the supply voltage is larger than the input voltage. Additionally, the 5V tolerant input pins enable down translation when the input voltage is larger than the supply voltage. The output level is always referenced to the supply voltage (VCC) and supports 1.8V, 2.5V, 3.3V, and 5V CMOS levels.
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技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | SN74LV8T273 Translating Octal D-Type Flip-Flops with Clear datasheet (Rev. A) | PDF | HTML | 2026年 6月 2日 |
設計與開發
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14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組
14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
14-24-NL-LOGIC-EVM — 適用於 14 針腳至 24 針腳無引線封裝的邏輯產品通用評估模組
14-24-NL-LOGIC-EVM 是一款靈活的評估模組 (EVM),設計用於支援任何具有 14 針腳至 24 針腳 BQA、BQB、RGY、RSV、RJW 或 RHL 封裝的邏輯或轉換裝置。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (PW) | 20 | Ultra Librarian |
| VQFN (RKS) | 20 | Ultra Librarian |
| VSSOP (DGS) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點