TB5T1
- Functional Replacement for the Agere BTF1A
- Driver Features
- Third-State Logic Low Output
- ESD Protection HBM > 3 kV, CDM > 2 kV
- No Line Loading when VCC = 0
- Capable of Driving 50-
loads - 2.0-ns Maximum Propagation Delay
- 0.2-ns Output Skew (typical)
- Receiver Features
- High-Input Impedance Approximately 8 k
- 4.0-ns Maximum Propagation Delay
- 50-mV Hysteresis
- Slew Rate Limited (1 ns min 80% to 20%)
- ESD Protection HBM > 3 kV, CDM > 2 kV
- -1.1-V to 7.1-V Input Voltage Range
- High-Input Impedance Approximately 8 k
- Common Device Features
- Common Enable for Each Driver/Receiver Pair
- Operating Temperature Range: -40°C to 85°C
- Single 5.0 V ± 10% Supply
- Available in Gull-Wing SOIC (JEDEC MS-013, DW) and SOIC (D) Package
The TB5T1 device is a dual differential driver/receiver circuit that transmits and receives digital data over balanced transmission lines. The dual drivers translate input TTL logic levels to differential pseudo-ECL output levels. The dual receivers convert differential-input logic levels to TTL output levels. Each driver or receiver pair has its own common enable control allowing serial data and a control clock to be transmitted and received on a single integrated circuit. The TB5T1 requires the customer to supply termination resistors on the circuit board.
The power-down loading characteristics of the receiver input circuit are approximately 8 k relative to the power supplies; hence, it does not load the transmission line when the circuit is powered down.
In circuits with termination resistors, the line remains impedance- matched when the circuit is powered down. The driver does not load the line when it is powered down.
All devices are characterized for operation from -40°C to 85°C.
The logic inputs of this device include internal pull-up resistors of approximately 40 k that are connected to VCC to ensure a logical high level input if the inputs are open circuited.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TB5T1, Dual Differential PECL Driver/Receiver datasheet (Rev. C) | 2007年 10月 23日 |
設計與開發
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TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |
| SOIC (DW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點