封裝資訊
| 封裝 | 引腳 WSON (DRV) | 6 |
| 作業溫度範圍 (°C) -40 to 125 |
| 包裝數量 | 運送包裝 3,000 | LARGE T&R |
TLV757P 的特色
- SOT-23 (DYD) package with 60.3°C/W RθJA available
- Input voltage range: 1.45V to 5.5V
- Available in fixed-output
voltages:
- 0.6V to 5V (50mV steps)
- Low IQ: 25µA (typical)
- Low dropout:
- 425mV (maximum) at 1A (3.3VOUT)
- Output accuracy: 1% (maximum)
- Built-in soft-start with monotonic VOUT rise
- Foldback current limit
- Active output discharge
- High PSRR: 45dB at 100kHz
- Stable with a 1µF ceramic output capacitor
- Packages:
- 2.9mm × 2.8mm SOT-23-5 (DBV)
- 2.9mm × 2.8mm SOT-23-5 (DYD) with thermal pad
- 2mm × 2mm WSON-6 (DRV)
TLV757P 的說明
The TLV757P low-dropout regulator (LDO) is an ultra-small, low quiescent current LDO that sources 1A with good line and load transient performance. The TLV757P is optimized for a wide variety of applications by supporting an input voltage range from 1.45V to 5.5V. To minimize cost and solution size, the device is offered in fixed output voltages ranging from 0.6V to 5V. This range supports the lower core voltages of modern microcontrollers (MCUs). Additionally, the TLV757P has a low IQ with enable functionality to minimize standby power. This device features an internal soft-start to lower the inrush current. This feature provides a controlled voltage to the load and minimizes the input voltage drop during start-up. When shutdown, the device actively pulls down the output to quickly discharge the outputs and provides a known start-up state.
The TLV757P is stable with small ceramic output capacitors allowing for a small overall solution size. A precision band-gap and error amplifier provides a typical accuracy of 1%. All device versions have integrated thermal shutdown, current limit, and undervoltage lockout (UVLO). The TLV757P has an internal foldback current limit that helps reduce thermal dissipation during short-circuit events.
The TLV757 is available in the popular SON and SOT23-5 packages. This device is also available in a thermally enhanced SOT23-5 package (DYD) with a thermal pad. This package provides significantly reduced thermal resistance compared to a standard SOT23-5 package.