TPD1E01B04-Q1

現行

採用 0402 封裝且適用於 USB 與 FPD-Link 的車用 0.2-pF、±3.6-V、±15-kV ESD 防護二極體

產品詳細資料

Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 27 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 0.2 Clamping voltage (V) 15 Breakdown voltage (min) (V) 6.4
Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 27 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 0.2 Clamping voltage (V) 15 Breakdown voltage (min) (V) 6.4
X1SON (DPY) 2 0.6 mm² 1 x 0.6
  • IEC 61000-4-2 level 4 ESD protection
    • ±15-kV contact discharge
    • ±17-kV air gap discharge
  • IEC 61000-4-4 EFT protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 surge protection
    • 2.5 A (8/20 µs)
  • IO capacitance:
    • 0.20 pF (typical)
    • 0.23 pF (maximum)
  • DC breakdown voltage: 6.4 V (typical)
  • Ultra low leakage current: 10-nA (maximum)
  • Low ESD clamping voltage: 15 V at 16 A TLP
  • Low insertion loss: 20 GHz
  • Supports high speed interfaces up to 20 Gbps
  • Industry standard 0402 footprint
  • AEC-Q101 qualified
    • Device HBM classification level H2
    • Device CDM classification level C5
    • Device operating temperature range: –40°C to +125°C
  • IEC 61000-4-2 level 4 ESD protection
    • ±15-kV contact discharge
    • ±17-kV air gap discharge
  • IEC 61000-4-4 EFT protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 surge protection
    • 2.5 A (8/20 µs)
  • IO capacitance:
    • 0.20 pF (typical)
    • 0.23 pF (maximum)
  • DC breakdown voltage: 6.4 V (typical)
  • Ultra low leakage current: 10-nA (maximum)
  • Low ESD clamping voltage: 15 V at 16 A TLP
  • Low insertion loss: 20 GHz
  • Supports high speed interfaces up to 20 Gbps
  • Industry standard 0402 footprint
  • AEC-Q101 qualified
    • Device HBM classification level H2
    • Device CDM classification level C5
    • Device operating temperature range: –40°C to +125°C

The TPD1E01B04-Q1 is a bidirectional TVS ESD protection diode for USB Type-C and FPD-Link circuit protection. The TPD1E01B04-Q1 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

This device features a 0.20-pF (typical) IO capacitance making it ideal for protecting high-speed interfaces up to 20 Gbps such as USB 3.1 Gen2 and FPD-Link. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

The TPD1E01B04-Q1 is offered in the industry standard 0402 (DPY) package.

The TPD1E01B04-Q1 is a bidirectional TVS ESD protection diode for USB Type-C and FPD-Link circuit protection. The TPD1E01B04-Q1 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

This device features a 0.20-pF (typical) IO capacitance making it ideal for protecting high-speed interfaces up to 20 Gbps such as USB 3.1 Gen2 and FPD-Link. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

The TPD1E01B04-Q1 is offered in the industry standard 0402 (DPY) package.

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類型 標題 日期
* Data sheet TPD1E01B04-Q1 Automotive 0.2-pF, ±3.6-V, ±15-kVESD Protection Diode in 0402 Package datasheet (Rev. A) PDF | HTML 2021年 12月 10日
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 2024年 1月 11日
Application brief ESD Protection for HDMI Applications (Rev. A) PDF | HTML 2023年 11月 1日
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 2022年 8月 18日
Application note ISO 10605 Road Vehicles Test Methods for Elec. Disturbances from Electrostatic D (Rev. B) PDF | HTML 2022年 8月 17日
Application brief ESD Protection for Automotive Infotainment (Rev. A) PDF | HTML 2021年 11月 12日
Application brief Automotive SerDes ESD Protection (Rev. A) PDF | HTML 2021年 10月 6日
Technical article ESD fundamentals, part 4: ESD capacitance PDF | HTML 2018年 2月 12日

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<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
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