產品詳細資料

Bits (#) 19 Data rate (max) (Mbps) 60 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.1 Vin (max) (V) 3.6 Vout (min) (V) 1.1 Vout (max) (V) 3.6 Applications MMC, SD Card, SDIO, UART Audio Features Output enable Technology family TWL Supply current (max) (mA) 0.03 Rating Catalog Operating temperature range (°C) -40 to 85
Bits (#) 19 Data rate (max) (Mbps) 60 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.1 Vin (max) (V) 3.6 Vout (min) (V) 1.1 Vout (max) (V) 3.6 Applications MMC, SD Card, SDIO, UART Audio Features Output enable Technology family TWL Supply current (max) (mA) 0.03 Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFF) 49 9 mm² (— mm × — mm)
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
  • Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility
    Gap Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2500-V Human-Body Model (A114-B)
    • 250-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)

  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
  • Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility
    Gap Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2500-V Human-Body Model (A114-B)
    • 250-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)

The TWL1200 is an 19-bit voltage translator specifically designed to seamlessly bridge the

1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). It is optimized for SDIO, UART, and audio functions. The TWL1200 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200 enables system designers to easily interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.

The TWL1200 is offered in both 48-ball 0.5-mm ball grid array (BGA) and 49-bump 0.4-mm wafer chip scale package (WCSP) packages. Low static power consumption and small package size make the TWL1200 an ideal choice for mobile-phone applications.

The TWL1200 is an 19-bit voltage translator specifically designed to seamlessly bridge the

1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). It is optimized for SDIO, UART, and audio functions. The TWL1200 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200 enables system designers to easily interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.

The TWL1200 is offered in both 48-ball 0.5-mm ball grid array (BGA) and 49-bump 0.4-mm wafer chip scale package (WCSP) packages. Low static power consumption and small package size make the TWL1200 an ideal choice for mobile-phone applications.

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 SDIO, UART, and Audio Voltage-Translation Transceiver datasheet (Rev. A) 2009/11/12
應用說明 Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 2024/7/12
應用說明 Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024/7/3
選擇指南 Voltage Translation Buying Guide (Rev. A) 2021/4/15
應用說明 TWL1200 PCB Design Guidelines 2009/7/6

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模擬型號

TWL1200 IBIS Model

SLLM073.ZIP (1043 KB) - IBIS 模型
支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
DSBGA (YFF) 49 Ultra Librarian

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