5-Vin to 5-Vout, 100-mA, low-EMI, 5-kVRMS reinforced isolation DC/DC power supply reference design


Design files


This reference design uses four UCC12050 high-efficiency, low-EMI, 5-kVRMS reinforced isolation, DC/DC converters on a single printed circuit board. The reference design includes additional provisions such as ferrite beads for optimized low-EMI emissions. Output voltages, VISO, can be selected for 3.3 V, 3.7 V, 5 V (default) and 5.4 V. Each of the four outputs includes a 100-mA, 500-mW load resistor commanding maximum output power by default but can easily be changed to accommodate any desired output load, up to 500 mW for any single converter. A single SMB input connector (J3) is included to allow easy and convenient connection to the input voltage source through a shielded input cable. The primary intent of this reference design is to investigate the impact that multiple high frequency converters have on EMI according to the CISPR 32, class-B test standard. Applications include isolated bias supplies for isolated data converters, amplifiers and motor drivers used in industrial, factory automation and grid infrastructure systems.

  • Low EMI
  • 5-kVrms reinforced isolation
  • Fully integrated DC/DC converter
Output voltage options PMP22682.1
Vin (Min) (V) 4.5
Vin (Max) (V) 5.5
Vout (Nom) (V) 5
Iout (Max) (A) .1
Output Power (W) .5
Isolated/Non-Isolated Isolated
Input Type DC
Topology Other

A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDT232.PDF (880 K)

Test results for the reference design, including efficiency graphs, test prerequisites and more

TIDM931.PDF (327 K)

Detailed schematic diagram for design layout and components

TIDM932.PDF (166 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDM933.PDF (248 K)

Detailed overview of design layout for component placement

TIDM935.ZIP (9074 K)

Files used for 3D models or 2D drawings of IC components

TIDCG23.ZIP (301 K)

Design file that contains information on physical board layer of design PCB

TIDM934.PDF (526 K)

PCB layer plot file used for generating PCB design layout


Includes TI products in the design and potential alternatives.

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Technical documentation

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Type Title Date
* Test report 5-VIN to 5-VOUT, 100-mA, low-EMI, 5-kVRMS Reinforced Isolation DC/DC Power Suppl Sep. 27, 2021
White paper High-Voltage Semiconductor Solutions for Meeting Isolation Requirements Jan. 20, 2021

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