Intel IMVP7 3rd Generation Core Mobile (Core i7) Power Management Reference Design
TIDA-00021
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Description & Features

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Description

The Intel Core i7 power management design is a complete solution for Intel IMVP-7 SVID.  A GUI communication program is available along with several test points on the board to evaluate the static and dynamic performance of the CPU's DC/DC Controller.  The design features an IMVP-7 3-Phase CPU supply,  a 2 Phase GPU Vcore supply, a 1.05VCCIO supply, and a DDR3L/DDR4 memory rail.  To greatly improve power density and thermal performance, TI's 5-mm x 6mm NEXFET Power Block MOSFETs are used.

Features

• Design supports a 9-20V input from Vbatt
• Small high-density power solution for Ivy Bridge
• 3 Phase CPU supply supports up to 94A
• 90% peak (80% full-load) efficiency from 12Vin to 1.05Vout - CPU Supply
• Low CPU supply ripple: 25mV
• Design has been built and tested.  Board available.


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Schematic/Block Diagram

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Test Data

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Design Files

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TI Devices (2)

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Part Number Name Product Family Sample & Buy Design Kits & Evaluation Modules
TLV717P  150-mA, low-IQ, low-dropout voltage regulator with active output discharge & enable  Power management  Sample & Buy View Design Kits & Evaluation Modules
TPS59650  Dual Channel (3-Phase CPU / 2-Phase GPU) SVID, D-CAP+TM Step-Down Controller  Step-down (buck) regulators  Sample & Buy Not Available

CAD/CAE symbols

Part # Package | Pins CAD File (.bxl) STEP Model (.stp)
TLV717P Download Download

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Technical documentation

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User guide (1)
Title Type Size (KB) Date
PDF 5025 23 Aug 2013
Design files (4)
Title Type Size (KB) Date
PDF 3815 23 Aug 2013
ZIP 2074 23 Aug 2013
PDF 145 23 Aug 2013
PDF 913 23 Aug 2013
Related Tools & Software

Software development (1)



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