TIDA-00563

Inductive Proximity Switch BoosterPack Reference Design

TIDA-00563

Design files

Overview

TIDA-00563 offers highly-integrated analog front end (AFE) inductance-to-digital converters (LDCs) optimized for use in industrial proximity sensors for contactless and robust applications such as presence detection and event counting. Inductive sensing technology provides reliable and accurate sensing even in the presence on dirt, oil or moisture making them ideal for use in harsh or dirty environments. This reference design uses a 1.8-V to 3.3-V high-resolution, high-speed inductance-to-digital converter which provides a programmable decision threshold setting and wide sensor frequency range. The scope of this design is to give you a head start in integrating our LDC, ultra-low-power MCU and power management devices into end-equipment systems. This design guide for this reference design describes the principle of operation and basic design process for building a high performance and high reliable inductive proximity switch at lower cost. All the relevant design files like schematics, BOM, layer plots, Altium files, Gerber and MSP430 MCU firmware are provided.

Features
  • Inductive sensing technology
  • Non-contact detection of metallic targets at shorter ranges
  • Increased flexibility and performance without requiring analog trimming techniques
  • Operating distance: 6 mm and programmed for hysteresis of 1 mm
  • Insensitive to environmental contamination
  • More reliable operation sensor self-diagnostic
  • Replaces legacy analog-only solutions
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDRJL5.PDF (493 K)

Detailed schematic diagram for design layout and components

TIDRJL6.PDF (51 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRJL7.PDF (177 K)

Detailed overview of design layout for component placement

TIDRJL9.ZIP (1436 K)

Files used for 3D models or 2D drawings of IC components

TIDCBM5.ZIP (2264 K)

Design file that contains information on physical board layer of design PCB

TIDRJL8.PDF (1125 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

ESD protection diodes

TPD1E10B0612-pF, ±5.5V, ±30-kV ESD protection diode in 0402 and SOD-523 package

Data sheet: PDF | HTML
ESD protection diodes

TPD2E001Dual 1.5-pF, 5.5-V, ±8-kV ESD protection diode with 1-nA max leakage & VCC pin for USB 2.0

Data sheet: PDF | HTML
Inductive sensor AFEs

LDC11011-Ch, 1.8V, 24-bit L, 16-bit Rp, inductance to digital converter for high speed applications

Data sheet: PDF | HTML
Linear & low-dropout (LDO) regulators

LP5951150-mA, low-IQ, low-dropout voltage regulator with enable

Data sheet: PDF | HTML
MSP430 microcontrollers

MSP430F552825 MHz MCU with 128KB Flash, 8KB SRAM, 12-bit ADC, comparator, DMA, UART/SPI/I2C, USB, HW multiplier

Data sheet: PDF | HTML

Start development

Software

GUI for evaluation module (EVM)

SNOC032 LDC1101EVM GUI

lock = Requires export approval (1 minute)
Supported products & hardware

Supported products & hardware

Hardware development
Evaluation board
LDC1101EVM LDC1101 1.8V, High Resolution Inductance to Digital Converter Evaluation Module

SNOC032 LDC1101EVM GUI

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Latest version
Version: 01.00.00.00
Release date: 28 Jun 2015
lock = Requires export approval (1 minute)
Hardware development
Evaluation board
LDC1101EVM LDC1101 1.8V, High Resolution Inductance to Digital Converter Evaluation Module

Technical documentation

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Type Title Date
* User guide Inductive Proximity Switch BoosterPack Design Guide (Rev. A) Dec. 09, 2015

Related design resources

Reference designs

REFERENCE DESIGN
TIDA-00460 Inductive Linear Position Sensing Booster Pack Reference Design

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