TIDC-01001

Commissioning Sensors in a Sub-1 GHz Network Over Bluetooth® low energy Reference Design

Design files

TIDC-01001

Design files

Overview

This reference design demonstrates how to commission a sub-1 GHz sensor node over Bluetooth® low energy, which enables quick connectivity with a smartphone or tablet. The design is powered by the SimpleLink™ dual-band CC1350 wireless microcontroller (MCU), which is the sensor node being commissioned. There is an added option to emulate a sensor network concentrator using a SimpleLink dual-band CC1350 or sub-1 GHz CC1310 devices for a complete user experience.

The goal of this reference design is to reduce the complexity and cost of the commissioning process. This design also demonstrates how to reduce the overall connection time by a factor of 100 or more by removing the need to re-flash the network credentials to the device.

Features

Enables simple commissioning of a sensor in a sub-1 GHz network over Bluetooth low energy using a smartphone or tablet device
Switches within 20 ms from connectable Bluetooth low energy to a sub-1 GHz network connection
Supported by our SimpleLink dual-band CC1350 LaunchPad™ development kits acting as the sensor device
Leverages the latest SimpleLink CC13xx TI-RTOS RF driver examples and latest BLE-Stack, providing a scalable software development platform

Industrial

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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

Design guide — TIDC-01001

TIDUCO2.PDF (1449 K)

Reference design overview and verified performance test data

Schematic — TIDC-01001

TIDRPW2.PDF (130 K)

Detailed schematic diagram for design layout and components

Schematic — TIDC-01001

TIDRPW3.PDF (130 K)

Detailed schematic diagram for design layout and components

Bill of materials (BOM) — TIDC-01001

TIDRPW4.PDF (165 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

Bill of materials (BOM) — TIDC-01001

TIDRPW5.PDF (164 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

Assembly drawing — TIDC-01001

TIDRPW6.PDF (131 K)

Detailed overview of design layout for component placement

CAD/CAE symbol — TIDC-01001

TIDRPW8.ZIP (8591 K)

Files used for 3D models or 2D drawings of IC components

Gerber file — TIDC-01001

TIDCD67.ZIP (261 K)

Design file that contains information on physical board layer of design PCB

PCB layout — TIDC-01001

TIDRPW7.PDF (1232 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Sub-1 GHz wireless MCUs

CC1350 — SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol Sub-1 GHz & 2.4 GHz wireless MCU with 128kB Flash

Data sheet: PDF | HTML

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Software

Support software

TIDCD68 — CC1350 Dual Mode TX Software (TIDC-01001)

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Supported products & hardware

Supported products & hardware

Products

Sub-1 GHz wireless MCUs

CC1350 — SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol Sub-1 GHz & 2.4 GHz wireless MCU with 128kB Flash

TIDCD68 — CC1350 Dual Mode TX Software (TIDC-01001)

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Latest version

Version: 01.00.00.00

Release date: 09 Feb 2017

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CC1350 Dual Mode TX Software (TIDC-01001) (zip) — 36 K

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Products

Sub-1 GHz wireless MCUs

CC1350 — SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol Sub-1 GHz & 2.4 GHz wireless MCU with 128kB Flash

Technical documentation

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	Type	Title		Date
*	Design guide	Commissioning Sensors in a Sub-1 GHz Network Over Bluetooth® Reference Design		Dec. 14, 2016

Related design resources

Hardware development

DEVELOPMENT KIT

LAUNCHXL-CC1350 — CC1350 LaunchPad™ development kit for SimpleLink™ dual-band wireless MCU

Software development

DRIVER OR LIBRARY

BLE-STACK — Bluetooth Low Energy software stack

Support & training

TI E2E™ forums with technical support from TI engineers

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