TIDC-01001

Commissioning Sensors in a Sub-1 GHz Network Over Bluetooth® low energy Reference Design

TIDC-01001

Design files

Overview

This reference design demonstrates how to commission a sub-1 GHz sensor node over Bluetooth® low energy, which enables quick connectivity with a smartphone or tablet. The design is powered by the SimpleLink™ dual-band CC1350 wireless microcontroller (MCU), which is the sensor node being commissioned. There is an added option to emulate a sensor network concentrator using a SimpleLink dual-band CC1350 or sub-1 GHz CC1310 devices for a complete user experience.

The goal of this reference design is to reduce the complexity and cost of the commissioning process. This design also demonstrates how to reduce the overall connection time by a factor of 100 or more by removing the need to re-flash the network credentials to the device.

Features
  • Enables simple commissioning of a sensor in a sub-1 GHz network over Bluetooth low energy using a smartphone or tablet device
  • Switches within 20 ms from connectable Bluetooth low energy to a sub-1 GHz network connection
  • Supported by our SimpleLink dual-band CC1350 LaunchPad™ development kits acting as the sensor device
  • Leverages the latest SimpleLink CC13xx TI-RTOS RF driver examples and latest BLE-Stack, providing a scalable software development platform

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUCO2.PDF (1449 K)

Reference design overview and verified performance test data

TIDRPW2.PDF (130 K)

Detailed schematic diagram for design layout and components

TIDRPW3.PDF (130 K)

Detailed schematic diagram for design layout and components

TIDRPW4.PDF (165 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRPW5.PDF (164 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRPW6.PDF (131 K)

Detailed overview of design layout for component placement

TIDRPW8.ZIP (8591 K)

Files used for 3D models or 2D drawings of IC components

TIDCD67.ZIP (261 K)

Design file that contains information on physical board layer of design PCB

TIDRPW7.PDF (1232 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Multi-protocol products

CC1350SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol Sub-1 GHz & 2.4 GHz wireless MCU with 128kB Flash

Data sheet document-pdfAcrobat PDF open-in-new HTML

Start development

Software

Support software

CC1350 Dual Mode TX Software (TIDC-01001) – TIDCD68.ZIP (36 K)

Technical documentation

star
= Top documentation selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Design guide Commissioning Sensors in a Sub-1 GHz Network Over Bluetooth® Reference Design Dec. 14, 2016

Related design resources

Hardware development

DEVELOPMENT KIT
LAUNCHXL-CC1350 SimpleLink™ Dual-Band CC1350 Wireless MCU LaunchPad Development Kit

Software development

DRIVER OR LIBRARY
BLE-STACK Bluetooth Low Energy software stack

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​

Videos