TIDEP-0097

Entry-level head unit display audio with Jacinto™ 6 entry reference design

TIDEP-0097

Design files

Overview

Based on TI's Jacinto™ DRA71x processor, this automotive reference design focuses on system-level cost savings. The 6 layer design reduces PCB costs through an optimized via breakout scheme, integration of key features and an optimized power distribution network. Functionality can be added or removed based on the end-product requirements. This design targets applications such as infotainment and reconfigurable digital cluster; and supports HDMI, USB3.0/2.0, TAS6424 Digital Class D Amplifier, and FPD-Link interface and multiple other features. It includes a 12V input with a single PMIC. In addition, a Linux, Android, or QNX based software development kit is included.

Features
  • TI Jacinto DRA71x processor with integrated features help customers design cost effective, feature rich, entry level (display audio) infotainment and cluster systems
  • ARM Cortex-A15 based processor with 600MHz, 800MHz, and 1GHz speeds, as well as 3D/2D graphics, C66x DSP and Cortex M4 options
  • Processor Software Development Kit (SDK) for Linux, Android, and QNX development
  • Cost saving features include 6 layer hardware design, rear view camera support, tuner integration with software defined radio, Class D amplifier and multi zone audio support
  • Includes TI's TPS65919 Power Management IC and TAS6424 Class D Audio Amplifier

A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUDN2.PDF (1263 K)

Reference design overview and verified performance test data

TIDRTS1.PDF (944 K)

Detailed schematic diagram for design layout and components

TIDRVL7.ZIP (37 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRTS2.PDF (50 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRTS3.PDF (118 K)

Detailed overview of design layout for component placement

TIDRTS5.ZIP (5105 K)

Files used for 3D models or 2D drawings of IC components

TIDCE26.ZIP (937 K)

Design file that contains information on physical board layer of design PCB

TIDRTS4.PDF (1127 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Arm-based processors

DRA710600 MHz Arm Cortex-A15 SoC processor with graphics for infotainment & cluster

Data sheet document-pdfAcrobat PDF open-in-new HTML
Ethernet PHYs

DP83TC811R-Q1Low-power 100BASE-T1 automotive PHYTER™ Ethernet physical layer transceiver

Data sheet document-pdfAcrobat PDF open-in-new HTML
Ethernet PHYs

DP83TC811S-Q1Automotive Grade 1, low-power 100BASE-T1 Ethernet PHY transceiver with xMII support & diagnostic too

Data sheet document-pdfAcrobat PDF open-in-new HTML
FPD-Link SerDes

DS90UB921-Q15-96 MHz 24-bit Color FPD-Link III Serializer

Data sheet document-pdfAcrobat PDF open-in-new HTML
Multi-channel ICs (PMICs)

TPS65919-Q1Automotive 3.15V to 5.25V, 4 buck & 4 LDO Power Management IC (PMIC)

Data sheet document-pdfAcrobat PDF open-in-new HTML
Speaker amps

TAS6424-Q1Automotive, 75-W, 2-MHz, 4-ch 4.5- to 26.4-V digital input Class-D audio amplifier w/ load dump

Data sheet document-pdfAcrobat PDF open-in-new HTML

Technical documentation

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Type Title Date
* Design guide Cost-Effective In-Vehicle Infotainment System Reference Design Nov. 29, 2017
User guide DRA71x Cost Effective Automotive Reference Design Nov. 01, 2017

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