TIDEP0037

Using TMS320C6678 Processor to Implement Power Efficient Scalable H.265/HEVC Solution Ref Design

TIDEP0037

Design files

Overview

HEVC is an efficient, but processing intensive video standard, that is said to double the data compression ratio compared to H.264 / MPEG-4 at the same level of video quality. This design shows how a power efficient, soft H.265 / HEVC solution, that scales across resolutions, frame rates & profiles, can be implemented in real time using one or more TMS320C6678 devices.  A specific use case of a single channel HEVC 720p30 real time encoder and single channel HEVC 1080p60 real time decoder is also included.  TI’s HEVC C66x HEVC encoder shows a bitrate saving, for the same visual quality, of greater than 40% compared with TI’s H.264 x encoder. TMS320C66x DSPs support both audio and video codecs.

Features
  • The TIDEP0037 reference design is tested, and includes a hardware reference (EVM), software and a user's guide.
  • TMDSEVM6678 EVM for a high performance, cost-efficient, standalone development platform, using the TMS320C6678 high-performance DSP based on TI's C66x Keystone multicore architecture.
  • This design includes schematics, design files, and a bill of materials.
  • HEVC/ H.265 encoder and decoder, MCSDK framework and other software packages
  • Design guide discusses performance and scalability across DSP cores and devices to achieve desired HEVC configuration

A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUA83A.PDF (427 K)

Reference design overview and verified performance test data

TIDRFT2.PDF (1122 K)

Detailed schematic diagram for design layout and components

TIDRFT3.PDF (233 K)

Detailed schematic diagram for design layout and components

TIDRFT4.PDF (131 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRFT6.ZIP (699 K)

Files used for 3D models or 2D drawings of IC components

TIDCAL6.ZIP (6050 K)

Design file that contains information on physical board layer of design PCB

TIDRFT5.ZIP (4216 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Arm-based processors

66AK2H06High performance multicore DSP+Arm - 2x Arm A15 cores, 4x C66x DSP cores

Data sheet: PDF | HTML
Arm-based processors

66AK2H12High performance multicore DSP+Arm - 4x Arm A15 cores, 8x C66x DSP cores

Data sheet: PDF | HTML
Arm-based processors

66AK2H14High performance multicore DSP+Arm - 4x Arm A15 cores, 8x C66x DSP cores, 10GbE

Data sheet: PDF | HTML
Digital signal processors (DSPs)

TMS320C6674High performance quad-core C66x fixed and floating-point DSP- up to 1.25GHz

Data sheet: PDF
Digital signal processors (DSPs)

TMS320C6678High performance octo-core C66x fixed and floating-point DSP- up to 1.25GHz

Data sheet: PDF

Technical documentation

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Type Title Date
* Design guide Using TMS320C6678 to Implement H.265/HEVC Design Guide (Rev. A) Oct. 19, 2015

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