66AK2H06 (ACTIVE) Multicore DSP+Arm, 2x Arm A15 cores, 4x C66x DSP cores

• Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With
  • 1.0 GHz or 1.2 GHz C66x Fixed- and Floating-Point DSP Core
    • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
    • 19.2 GFlops/Core for Floating Point @ 1.2 GHz
  • Memory
    • 32-KB L1P Per CorePac
    • 32-KB L1D Per CorePac
    • 1024-KB Local L2 Per CorePac
• ARM CorePac
  • Four ARM^® Cortex^®-A15 MPCore™ Processors at up to 1.4 GHz
  • 4MB of L2 Cache Memory Shared by Four ARM Cores
  • Full Implementation of ARMv7-A Architecture Instruction Set
  • 32-KB L1 Instruction and Data Caches per Core
  • AMBA 4.0 AXI Coherency Extension (ACE) Master Port, Connected to MSMC for Low-Latency Access to Shared MSMC SRAM
• Multicore Shared Memory Controller (MSMC)
  • 6MB of MSM SRAM Memory Shared by Eight DSP CorePacs and One ARM CorePac
  • Memory Protection Unit (MPU) for Both MSM SRAM and DDR3_EMIF
• Multicore Navigator
  • 16k Multipurpose Hardware Queues With Queue Manager
  • Packet-Based DMA for Zero-Overhead Transfers
• Network Coprocessor
  • Packet Accelerator Enables Support for
    • Transport Plane IPsec, GTP-U, SCTP, PDCP
    • L2 User Plane PDCP (RoHC, Air Ciphering)
    • 1-Gbps Wire Speed Throughput at 1.5 MPackets Per Second
  • Security Accelerator Engine Enables Support for
    • IPSec, SRTP, 3GPP, and WiMAX Air Interface, and SSL/TLS Security
    • ECB, CBC, CTR, F8, A5/3, CCM, GCM, HMAC, CMAC, GMAC, AES, DES, 3DES, Kasumi, SNOW 3G, SHA-1, SHA-2 (256-Bit Hash), MD5
    • Up to 2.4 Gbps IPSec and 2.4 Gbps Air Ciphering
  • Ethernet Subsystem
    • Five-Port Switch (Four SGMII Ports)
• Peripherals
  • Four Lanes of SRIO 2.1
    • Supports up to 5 GBaud
    • Supports Direct I/O, Message Passing
  • Two Lanes PCIe Gen2
    • Supports up to 5 GBaud
  • Two HyperLinks
    • Supports Connections to Other KeyStone™ Architecture Devices Providing Resource Scalability
    • Supports up to 50 GBaud
  • 10-Gigabit Ethernet (10-GbE) Switch Subsystem (66AK2H14 Only)
    • Two XFI Ports
    • IEEE 1588 Support
  • Five Enhanced Direct Memory Access (EDMA) Modules
  • Two 72-Bit DDR3/DDR3L Interfaces With Speeds up to 1600 MHz
  • EMIF16 Interface
  • USB 3.0
  • Two UART Interfaces
  • Three I²C Interfaces
  • 32 GPIO Pins
  • Three SPI Interfaces
  • Semaphore Module
  • 64-Bit Timers
    • Twenty 64-Bit Timers for 66AK2H14 and 66AK2H12
    • Fourteen 64-Bit Timers for 66AK2H06
  • Five On-Chip PLLs
• Commercial Case Temperature:
  • 0ºC to 85ºC
• Extended Case Temperature:
  • –40ºC to 100ºC

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