TIDM-INDUCTIVELINEAR

ESI + LDC Inductive Linear Position Sensing Reference Design

TIDM-INDUCTIVELINEAR

Design files

Overview

Typical implementations of linear position measurements use expensive rare-earth magnets. To lower the overall system cost, this reference design describes the implementation of using the industry’s first inductance-to-digital converters (LDC) from TI for linear position sensing without the use of any expensive rare-earth magnets. This reference design also describes the implementation of the ultra-low power two chip solution for inductive linear position sensors by using TI's extended scan interface (ESI) module on the MSP430(TM) microcontrollers (MCUs) and LDC1612 chip. By combining the ESI module on MSP430 MCU and the LDC technology, the reference design provides the designer a low-cost and low-power inductive linear position sensing solution.

Features
  • Ultra-low power
  • Non-contact detection and measurement
  • Insensitive to environmental contaminations
  • High resolution and accuracy
  • Increased Flexibility and Performance without requiring analog trimming techniques

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDRLR3.PDF (181 K)

Detailed schematic diagram for design layout and components

TIDRLR4.PDF (54 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRLR6.ZIP (526 K)

Files used for 3D models or 2D drawings of IC components

TIDCC65.ZIP (58 K)

Design file that contains information on physical board layer of design PCB

TIDRLR5.ZIP (156 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

MSP430 microcontrollers

MSP430FR6989Rotary Sensing MCU with extended scan interface, 128KB FRAM, AES, LCD for flow meters

Data sheet document-pdfAcrobat PDF open-in-new HTML
Inductive sensor AFEs

LDC16122-Ch, 28-bit, high-resolution Inductance to digital converter

Data sheet document-pdfAcrobat PDF open-in-new HTML

Start development

Hardware

Development kit

MSP-EXP430FR6989 – MSP430FR6989 LaunchPad Development Kit

The MSP-EXP430FR6989 LaunchPad Development Kit is an easy-to-use Evaluation Module (EVM) for the MSP40FR6989 microcontroller (MCU). It contains everything needed to start developing on the ultra-low-power MSP430FRx FRAM microcontroller platform, including on-board emulation for programming (...)

In stock
Limit: 10

Software

Support software

TIDM-INDUCTIVELINEAR Software – TIDCC66.ZIP (4220 K)

Technical documentation

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Type Title Date
* User guide ESI + LDC Inductive Linear Position Sensing Design Guide Dec. 31, 2015

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