CC256XMSPBTBLESW
MSP430™ MCU 的 TI 雙模式藍牙® 架構
CC256XMSPBTBLESW
概覽
TI’s Dual-mode Bluetooth stack on MSP430™ MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP430 MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), provides simple command line sample applications to speed development, and upon request has MFI capability.
For a complete evaluation solution, the CC256XMSPBTBLESW works directly with the TI hardware development kits: MSP-EXP430F5529 and MSP-EXP430F5438. Moreover the stack that is available for the MSP430 MCU, is certified and royalty-free.
The software works with all CC256x EM boards (CC256XQFNEM and CC2564MODNEM) which provide a complete Bluetooth BR/EDR/LE HCI solution, reducing design effort and enabling fast time to market. The CC256x EM boards include TI's seventh-generation Bluetooth core and provide a product-proven solution that is Bluetooth 4.1 compliant. The devices provide best-in-class RF performance with a transmit power and receive sensitivity that provides range of about 2X compared to other BLE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.
特點
- Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royaly free
- The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849)
- Fully Thread safe
- Supports non-threaded (No OS) environment
- Fully Documented API Interface
- Works with any MSP430 MCU with Flash >= 128KB and RAM >= 8KB
- Sample Apps are available for the MCU development kits below:
- MSP-EXP430F5529
- MSP-EXP430F5438
- Protocols/Profiles can be selectively enabled/disabled
- Supports CCS and IAR IDEs
- Classic Profiles Available
- Advanced Audio Distribution Profile (A2DP): A3DP Implementation
- Audio/Video Remote Control Profile (AVRCP)
- Generic Access Profile (GAP)
- Generic Audio/Video Distribution Profile (GAVDP)
- Hands Free Profile (HFP)
- Human Interface Device Profile (HID)
- Serial Port Profile (SPP)
- Bluetooth Low Energy Profiles Available
- Alert Notification Service (ANS)
- Alert Notification Profile (ANP)
- Battery Service (BAS)
- Device Information Service (DIS)
- Find Me Profile (FMP)
- Generic Access Profile Service (GAPS)
- Generic Attribute Profile (GATT)
- Health Thermometer Service (HTS)
- Health Thermometer Profile (HTP)
- Heart Rate Service (HRS)
- Heart Rate Profile (HRP)
- Human Interface Device Service (HIDS)
- HID over GATT Profile (HOGP)
- Immediate Alert Service (IAS)
- Link Loss Service (LLS)
- Phone Alert State Service (PASS)
- Phone Alert State Profile (PASP)
- Proximity Profile (PXP)
- TX Power Service (TPS)
下載項目
CC256XMSPBTBLESW — TI dual-mode Bluetooth® stack on MSP430 MCUs
CC256XMSPBTBLESW — TI dual-mode Bluetooth® stack on MSP430 MCUs
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版本資訊
技術文件
| 類型 | 標題 | 下載最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| 使用指南 | Dual-Mode Bluetooth CC2564 Module Evaluation Board User's Guide (Rev. A) | 2021/8/31 | ||||
| 網路安全諮詢 | InjectaBLE: Injecting Malicious Traffic Into Established Bluetooth® Low Energy | 2021/6/22 | ||||
| 網路安全諮詢 | Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) | PDF | HTML | 2020/5/18 | |||
| 應用說明 | CC2564 HFP/HID/SPP Integration Demonstration | 2018/11/20 | ||||
| 白皮書 | Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) | 2017/10/16 | ||||
| 更多文件說明 | Dual-mode Bluetooth CC256x solutions (Rev. C) | 2016/2/3 | ||||
| 使用指南 | Dual-Mode Bluetooth CC2564 Evaluation Board Quick Start Guide | 2015/10/1 | ||||
| 使用指南 | Dual-Mode Bluetooth CC2564 Module Evaluation Board Quick Start Guide | 2015/7/24 | ||||
| 白皮書 | Three Flavors of Bluetooth: Which One to Choose? | 2014/3/25 |