TI 並未針對此硬體提供持續直接設計支援。如需在進行設計時獲得支援，請聯絡 Forlinx Embedded Tech. Co., Ltd。
FORLX-3P-AM62L-EVM
概覽
The AM62L Evaluation Module, co‑engineered by Forlinx Embedded Technology and Texas Instruments, delivers a production‑grade, cost‑optimized platform for developers targeting AI‑enabled edge, vision, and industrial applications.
Leveraging Forlinx’s four‑layer PCB expertise and TI’s rigorous signal‑integrity standards, the AM62L EVM offers a high‑performance, budget‑friendly entry point that accelerates prototype development and reduces time‑to‑market while meeting industrial reliability and safety requirements.
特點
- Processor & Memory – TI AM62L Sitara SoC (dual‑core Cortex‑A53 + Cortex‑R5, up to 1.5 GHz) with up to 4 GB LPDDR4 X RAM and 128 GB eMMC 5.1 for fast boot and ample data storage.
- Connectivity & I/O – Gigabit Ethernet + PoE+, Wi‑Fi 6, Bluetooth 5.2, optional LTE‑Cat‑M1/NB‑IoT, USB 3.0/2.0, HDMI 2.0, MIPI‑CSI/DSI, 48‑pin FMC, CAN, SPI, I²C, UART, and a 40‑pin GPIO header.
- Integrated hardware & design efficiency – Compact board with all necessary power rails, pin headers, and an optimized 4‑layer layout that cuts part count and BOM cost.
- Power, thermal & safety – Wide 5‑36 V input, on‑board DC‑DC converters, heatsink‑ready design, operation from ‑40 °C to +85 °C, IEC 60730‑1 class B, RoHS‑compliant, CE‑marked, and EMI/EMC certified.
- Software ecosystem – Pre‑validated BSPs, TI Processor SDK, Linux 5.10 LTS, FreeRTOS, quick‑start guides; fully supported by Code Composer Studio, UniFlash, and the free XDS110 cloud debugger.
- Global technical support – Joint TI and Forlinx engineering teams provide worldwide assistance for firmware, software, and hardware issues.
- Compact form‑factor – 120 mm × 90 mm, 1.6 mm thick, with mounting holes for DIN‑rail or carrier‑board installation.
- Target applications – Ideal for edge AI inference, machine‑vision gateways, smart sensors, industrial IoT gateways, and rugged edge‑computing solutions.
多媒體與工業網路 SoC
訂購並開始開發
開發板
FORLX-AM62L-EVM-OK-DEV — Flylink evaluation board with TI AM62L32 chip, dual cores, 512 MB memory for industrial IoT
FORLX-AM62L-EVM-OK-DEV — Flylink evaluation board with TI AM62L32 chip, dual cores, 512 MB memory for industrial IoT
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