SBAS580D May   2013  – March 2018 ADS7250 , ADS7850 , ADS8350

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: All Devices
    6. 6.6  Electrical Characteristics: ADS7250
    7. 6.7  Electrical Characteristics: ADS7850
    8. 6.8  Electrical Characteristics: ADS8350
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics: ADS7250
    12. 6.12 Typical Characteristics: ADS7850
    13. 6.13 Typical Characteristics: ADS8350
    14. 6.14 Typical Characteristics: All Devices
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reference
      2. 7.3.2 Analog Input
        1. 7.3.2.1 Analog Input Full-Scale Range
      3. 7.3.3 ADC Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial Interface
      2. 7.4.2 Short-Cycling, Frame Abort, and Reconversion Feature
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 DAQ Circuit: Maximum SINAD for a 10-kHz Input Signal at 750-kSPS Throughput
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 ADC Reference Driver
          2. 8.2.1.2.2 ADC Input Driver
            1. 8.2.1.2.2.1 Input Amplifier Selection
            2. 8.2.1.2.2.2 Antialiasing Filter
        3. 8.2.1.3 Application Curve
      2. 8.2.2 DAQ Circuit: Maximum SINAD for a 100-kHz Input Signal at 750-kSPS Throughput
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 ADC Reference Driver
          2. 8.2.2.2.2 ADC Input Driver
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

Figure 63 shows a board layout example for the ADS7250, ADS7850, and ADS8350. Use a ground plane underneath the device and partition the PCB into analog and digital sections. Avoid crossing digital lines with the analog signal path and keep the analog input signals and the reference input signals away from noise sources. As shown in Figure 63, the analog input and reference signals are routed on the left side of the board and the digital connections are routed on the right side of the device.

The power sources to the ADS8350 must be clean and well-bypassed. Use 10-µF ceramic bypass capacitors in close proximity to the analog (AVDD) and digital (DVDD) power-supply pins. Avoid placing vias between the AVDD and DVDD pins and the bypass capacitors. Connect all ground pins to the ground plane using short, low-impedance paths.

The REFIN-A and REFIN-B reference inputs are bypassed with 10-µF, X7R-grade ceramic capacitors (CREF-x). Although the reference inputs of the device draw little current on average, there are instantaneous dynamic current demands placed on the reference circuitry characteristic of SAR ADCs. Place the reference bypass capacitors as close as possible to the reference REFIN-x pins and connect the bypass capacitors using short, low-inductance connections. Avoid placing vias between the REFIN-x pins and the bypass capacitors. If the reference voltage originates from an op amp, make sure that the op amp can drive the bypass capacitor without oscillation. Small 0.1-Ω to 0.2-Ω resistors (RREF-x) are used in series with the reference bypass capacitors to improve stability.

The fly-wheel RC filters are placed immediately next to the input pins. Among ceramic surface-mount capacitors, COG (NPO) ceramic capacitors provide the best capacitance precision. The type of dielectric used in COG (NPO) ceramic capacitors provides the most stable electrical properties over voltage, frequency, and temperature changes. Figure 63 shows the CIN-A and CIN-B filter capacitors placed across the analog input pins of the device.