SBASAQ6 April   2024 ADS9813

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
        1. 6.3.1.1 Input Clamp Protection Circuit
        2. 6.3.1.2 Programmable Gain Amplifier (PGA)
        3. 6.3.1.3 Wide-Common-Mode Voltage Rejection Circuit
      2. 6.3.2 ADC Transfer Function
      3. 6.3.3 ADC Sampling Clock Input
      4. 6.3.4 Synchronizing Multiple ADCs
      5. 6.3.5 Reference Voltage
      6. 6.3.6 Test Patterns for Data Interface
        1. 6.3.6.1 Fixed Pattern
        2. 6.3.6.2 Digital Ramp
        3. 6.3.6.3 Alternating Test Pattern
    4. 6.4 Device Functional Modes
      1. 6.4.1 Reset
      2. 6.4.2 Power-Down
      3. 6.4.3 Initialization Sequence
      4. 6.4.4 Normal Operation
    5. 6.5 Programming
      1. 6.5.1 Register Write
      2. 6.5.2 Register Read
      3. 6.5.3 Multiple Devices in a Daisy-Chain Topology for SPI Configuration
        1. 6.5.3.1 Register Write With Daisy-Chain
        2. 6.5.3.2 Register Read With Daisy-Chain
  8. 7 Register Map
    1. 7.1 Register Bank 0
    2. 7.2 Register Bank 1
    3. 7.3 Register Bank 2
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Parametric Measurement Unit (PMU)
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Timing Requirements

at AVDD_5V = 4.75V to 5.25V, VDD_1V8 = 1.75V to 1.85V, IOVDD = 1.15V to 1.85V, VREF = 4.096V (internal or external), and maximum throughput (unless otherwise noted); minimum and maximum values at TA = –40°C to +125°C; typical values at TA = 25°C
MIN MAX UNIT
CONVERSION CYCLE
fSMPL_CLK Sampling frequency 3.6 8 MHz
tSMPL_CLK Sampling time interval 1 / fSMPL_CLK ns
tPL_SMPL_CLK SMPL_CLK low time 0.45 tSMPL_CLK 0.55 tSMPL_CLK ns
tPH_SMPL_CLK SMPL_CLK high time 0.45 tSMPL_CLK 0.55 tSMPL_CLK ns
SPI INTERFACE TIMINGS (CONFIGURATION INTERFACE)
fSCLK Maximum SCLK frequency 20 MHz
tPH_CK SCLK high time 0.48 0.52 tCLK
tPL_CK SCLK low time 0.48 0.52 tCLK
thi_CS Pulse duration: CS high 220 ns
td_CSCK Delay time: CS falling to the first SCLK capture edge 20 ns
tsu_CKDI Setup time: SDI data valid to the SCLK rising edge 10 ns
tht_CKDI Hold time: SCLK rising edge to data valid on SDI 5 ns
tD_CKCS Delay time: last SCLK falling to CS rising 5 ns
CMOS DATA INTERFACE
tsu_SS Setup time: SMPL_SYNC rising edge to SMPL_CLK falling edge 10 ns
tht_SS Hold time: SMPL_CLK falling edge to SMPL_SYNC high 10 ns