SLUSF77 December   2023 BQ25960H

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Description (continued)
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Charging System
      2. 8.3.2  Battery Charging Profile
      3. 8.3.3  Device Power Up
      4. 8.3.4  Device HIZ State
      5. 8.3.5  Dual Input Bi-Directional Power Path Management
        1. 8.3.5.1 ACDRV Turn-On Condition
        2. 8.3.5.2 Single Input from VAC to VBUS without ACFET-RBFET
        3. 8.3.5.3 Single Input with ACFET1
        4. 8.3.5.4 Dual Input with ACFET1-RBFET1
        5. 8.3.5.5 Dual Input with ACFET1-RBFET1 and ACFET2-RBFET2
        6. 8.3.5.6 OTG and Reverse TX Mode Operation
      6. 8.3.6  Bypass Mode Operation
      7. 8.3.7  Charging Start-Up
      8. 8.3.8  Adapter Removal
      9. 8.3.9  Integrated 16-Bit ADC for Monitoring and Smart Adapter Feedback
      10. 8.3.10 Device Modes and Protection Status
        1. 8.3.10.1 Input Overvoltage, Overcurrent, Undercurrent, Reverse-Current and Short-Circuit Protection
        2. 8.3.10.2 Battery Overvoltage and Overcurrent Protection
        3. 8.3.10.3 IC Internal Thermal Shutdown, TSBUS, and TSBAT Temperature Monitoring
      11. 8.3.11 INT Pin, STAT, FLAG, and MASK Registers
      12. 8.3.12 Dual Charger Operation Using Primary and Secondary Modes
      13. 8.3.13 CDRVH and CDRVL_ADDRMS Functions
    4. 8.4 Programming
      1. 8.4.1 F/S Mode Protocol
    5. 8.5 Register Maps
      1. 8.5.1 I2C Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Standalone Application Information (for use with main charger)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
    2. 14.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VAC1, VAC2 Input voltage at VAC1 and VAC2 12 V
VBUS Input voltage at VBUS 12 V
PMID Input voltage at PMID 12 V
PMID-CFH1, PMID-CFH2 Voltage across QCH1, QCH2 6 V
CFH1-VOUT, CFH2-VOUT Voltage across QDH1, QDH2 6 V
VOUT-CFL1, VOUT-CFL2 Voltage across QCL1, QCL2 6 V
CFL1, CFL2 Voltage across QDL1, QDL2 6 V
ICHG Charging current 8 A
TA Ambient temperature –40 85 °C
TJ Junction temperature –40 120 °C
CCFLY Effective CFLY capacitance 6.6 20 µF
CVBUS Effective VBUS capacitance 0.2 1 µF
CPMID Effective PMID capacitance 2 10 µF
COUT Effective VOUT capacitance 2 10 µF
CREGN Effective REGN capacitance 1 4.7 µF
CDRV Effective DRV capacitance 44 220 nF