SBAS422B July   2007  – January 2018 DAC8881

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics for
    7. 6.7 Timing Characteristics for and
    8. 6.8 Typical Characteristics: VDD = +5 V
    9. 6.9 TYpical Characteristics: VDD = +2.7 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Output
      2. 7.3.2  Reference Inputs
      3. 7.3.3  Output Range
      4. 7.3.4  Input Data Format
      5. 7.3.5  Hardware Reset
      6. 7.3.6  Power-On Reset
      7. 7.3.7  Program Reset Value
      8. 7.3.8  Power Down
      9. 7.3.9  Double-Buffered Interface
      10. 7.3.10 Load DAC Pin (LDAC)
        1. 7.3.10.1 Synchronous Mode
        2. 7.3.10.2 Asynchronous Mode
      11. 7.3.11 1.8 V to 5.5 V Logic Interface
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial Interface
        1. 7.4.1.1 Input Shift Register
          1. 7.4.1.1.1 Stand-Alone Mode
          2. 7.4.1.1.2 Daisy-Chain Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bipolar Operation Using The DAC8881
    2. 8.2 Typical Application
      1. 8.2.1 DAC8881 Sample Hold Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.