SBAS422B July   2007  – January 2018 DAC8881

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics for
    7. 6.7 Timing Characteristics for and
    8. 6.8 Typical Characteristics: VDD = +5 V
    9. 6.9 TYpical Characteristics: VDD = +2.7 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Output
      2. 7.3.2  Reference Inputs
      3. 7.3.3  Output Range
      4. 7.3.4  Input Data Format
      5. 7.3.5  Hardware Reset
      6. 7.3.6  Power-On Reset
      7. 7.3.7  Program Reset Value
      8. 7.3.8  Power Down
      9. 7.3.9  Double-Buffered Interface
      10. 7.3.10 Load DAC Pin (LDAC)
        1. 7.3.10.1 Synchronous Mode
        2. 7.3.10.2 Asynchronous Mode
      11. 7.3.11 1.8 V to 5.5 V Logic Interface
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial Interface
        1. 7.4.1.1 Input Shift Register
          1. 7.4.1.1.1 Stand-Alone Mode
          2. 7.4.1.1.2 Daisy-Chain Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bipolar Operation Using The DAC8881
    2. 8.2 Typical Application
      1. 8.2.1 DAC8881 Sample Hold Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

A precision analog component requires careful layout, the list below provides some insight into good layout practices.

  • All Power Supply pins should be bypassed to ground with a low ESR ceramic bypass capacitor. The typical recommended bypass capacitance is 0.1 to 0.22 µF ceramic with a X7R or NP0 dielectric.
  • Power supplies and VrefH/L bypass capacitors should be placed close to terminals to minimize inductance and optimize performance.
  • A high-quality ceramic type NP0 or X7R is recommended for its optimal performance across temperature, and very low dissipation factor.
  • The digital and analog sections should have proper placement with respect to the digital pins and analog pins of the DAC8881 device. The separation of analog and digital blocks will allow for better design and practice as it will ensure less coupling into neighboring blocks, and will minimize the interaction between analog and digital return currents.