SNVS124G November   1999  – March 2023 LM2596

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics – 3.3-V Version
    6. 7.6  Electrical Characteristics – 5-V Version
    7. 7.7  Electrical Characteristics – 12-V Version
    8. 7.8  Electrical Characteristics – Adjustable Voltage Version
    9. 7.9  Electrical Characteristics – All Output Voltage Versions
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Delayed Start-Up
      2. 8.3.2 Undervoltage Lockout
      3. 8.3.3 Inverting Regulator
      4. 8.3.4 Inverting Regulator Shutdown Methods
    4. 8.4 Device Functional Modes
      1. 8.4.1 Discontinuous Mode Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor (CIN)
      2. 9.1.2 Feedforward Capacitor (CFF)
      3. 9.1.3 Output Capacitor (COUT)
      4. 9.1.4 Catch Diode
      5. 9.1.5 Inductor Selection
      6. 9.1.6 Output Voltage Ripple and Transients
      7. 9.1.7 Open-Core Inductors
    2. 9.2 Typical Applications
      1. 9.2.1 LM2596 Fixed Output Series Buck Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 9.2.1.2.2 Inductor Selection (L1)
          3. 9.2.1.2.3 Output Capacitor Selection (COUT)
          4. 9.2.1.2.4 Catch Diode Selection (D1)
          5. 9.2.1.2.5 Input Capacitor (CIN)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 LM2596 Adjustable Output Series Buck Regulator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Programming Output Voltage
          2. 9.2.2.2.2 Inductor Selection (L1)
          3. 9.2.2.2.3 Output Capacitor Selection (COUT)
          4. 9.2.2.2.4 Feedforward Capacitor (CFF)
          5. 9.2.2.2.5 Catch Diode Selection (D1)
          6. 9.2.2.2.6 Input Capacitor (CIN)
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
      3. 9.4.3 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design with WEBENCH® Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NDH|5
  • NEB|5
  • KTT|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision F (April 2021) to Revision G (March 2023)

  • Added link to LMR51430 and TLVM13630 product folders in the Features Go
  • Updated trademark informationGo

Changes from Revision E (February 2020) to Revision F (April 2021)

  • Removed reference to device comparison tableGo
  • Updated the numbering format for tables, figures, and cross-references throughout the document. Go

Changes from Revision D (May 2016) to Revision E (February 2020)

  • Added link to the LMR33630 product folder in the Section 1 Go
  • Updated Section 3 to include the LMR33630 product page, device comparison table, and WEBENCH link Go
  • Changed the package from 7 pins to 5 pins Go

Changes from Revision C (April 2013) to Revision D (February 2016)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Removed all references to design software Switchers Made Simple Go

Changes from Revision B (April 2013) to Revision C (April 2013)

  • Changed layout of National Semiconductor Data Sheet to TI formatGo