SNAS425C October   2007  – October 2014 LM98519

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Serial Interface Timing
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Input Clamping and Biasing Circuitry
      2. 7.3.2 Input Connections for 3 Channel Operation
      3. 7.3.3 AFE References
      4. 7.3.4 Offset Control
      5. 7.3.5 Black Level Calibration (Offset)
        1. 7.3.5.1 Manual Offset Adjustment
        2. 7.3.5.2 Automatic Offset Adjustment
        3. 7.3.5.3 Gain Control
        4. 7.3.5.4 White Level Calibration (AGC - Automatic Gain Control)
      6. 7.3.6 Operating Mode Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 AFEPHASEn Details for SHP/SHD Input Mode
      2. 7.4.2 AFEPHASEn Details for SAMPLE and HOLD Input Mode
      3. 7.4.3 AFEPHASEn: 6 Channel and 3 Channel Modes
      4. 7.4.4 LM98519 AFEPHASE Synchronization
      5. 7.4.5 Sampling Timing Diagrams
    5. 7.5 Programming
      1. 7.5.1  Using Black Pixel Average
      2. 7.5.2  Sample Timing Control
      3. 7.5.3  Timing Monitor Outputs
      4. 7.5.4  Output Data Test Pattern Generation
      5. 7.5.5  Fixed Pattern
      6. 7.5.6  Horizontal Gradation
      7. 7.5.7  Vertical Gradation
      8. 7.5.8  Lattice Pattern
      9. 7.5.9  Serial Interface
      10. 7.5.10 Serial Write
      11. 7.5.11 Serial Read
    6. 7.6 Register Maps
      1. 7.6.1 Configuration Registers
      2. 7.6.2 Configuration Register Details
  8. 8 Application and Implementation
    1. 8.1 Design Requirements
    2. 8.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 Over Voltage Protection on OS Inputs
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

11.2 Trademarks

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.