SNOS674I October   1997  – February 2024 LMC6482 , LMC6484

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information LMC6482
    5. 5.5 Thermal Information LMC6484
    6. 5.6 Electrical Characteristics: VS = 5V
    7. 5.7 Electrical Characteristics: VS = 3V
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Amplifier Topology
      2. 6.3.2 Input Common-Mode Voltage Range
      3. 6.3.3 Rail-to-Rail Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Upgrading Applications
      2. 7.1.2 Data Acquisition Systems
      3. 7.1.3 Instrumentation Circuits
    2. 7.2 Typical Applications
      1. 7.2.1 3V Single-Supply Buffer Circuit
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Capacitive Load Compensation
          2. 7.2.1.2.2 Capacitive Load Tolerance
          3. 7.2.1.2.3 Compensating For Input Capacitance
          4. 7.2.1.2.4 Offset Voltage Adjustment
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Typical Single-Supply Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Spice Macromodel
        2. 8.1.1.2 PSpice® for TI
        3. 8.1.1.3 TINA-TI™ Simulation Software (Free Download)
        4. 8.1.1.4 DIP-Adapter-EVM
        5. 8.1.1.5 DIYAMP-EVM
        6. 8.1.1.6 TI Reference Designs
        7. 8.1.1.7 Filter Design Tool
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.1.3 TINA-TI™ Simulation Software (Free Download)

TINA-TI™ simulation software is a simple, powerful, and easy-to-use circuit simulation program based on a SPICE engine. TINA-TI simulation software is a free, fully-functional version of the TINA™ software, preloaded with a library of macromodels, in addition to a range of both passive and active models. TINA-TI simulation software provides all the conventional dc, transient, and frequency domain analysis of SPICE, as well as additional design capabilities.

Available as a free download from the Design tools and simulation web page, TINA-TI simulation software offers extensive post-processing capability that allows users to format results in a variety of ways. Virtual instruments offer the ability to select input waveforms and probe circuit nodes, voltages, and waveforms, creating a dynamic quick-start tool.

Note:

These files require that either the TINA software or TINA-TI software be installed. Download the free TINA-TI simulation software from the TINA-TI™ software folder.