SNVS174I February   2003  – February 2015 LP3852 , LP3855

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematics
  5. 5 Revision History
  6. 6 Voltage Options
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 SENSE Pin
      2. 9.3.2 SHUTDOWN (SD) Operation
      3. 9.3.3 Dropout Voltage
      4. 9.3.4 Reverse Current Path
      5. 9.3.5 Short-Circuit Protection
      6. 9.3.6 ERROR Flag Operation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation with VOUT(TARGET) + 0.1 V ≤ VIN ≤ 7 V
      2. 9.4.2 Operation With SD Pin Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 External Capacitors
          1. 10.2.2.1.1 Input Capacitor
          2. 10.2.2.1.2 Output Capacitor
        2. 10.2.2.2 Operation with Ceramic Output Capacitors
        3. 10.2.2.3 Selecting A Capacitor
        4. 10.2.2.4 Capacitor Characteristics
          1. 10.2.2.4.1 Ceramic
          2. 10.2.2.4.2 Tantalum
          3. 10.2.2.4.3 Aluminum
        5. 10.2.2.5 Turnon Characteristics For Output Voltages Programmed to 2 V or Below
        6. 10.2.2.6 Output Noise
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 RFI and/or EMI Susceptibility
    4. 12.4 Power Dissipation/Heatsinking
      1. 12.4.1 Heatsinking TO-220 Package
      2. 12.4.2 Heatsinking TO-263 Package
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Related Links

Table 1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LP3852 Click here Click here Click here Click here Click here
LP3855 Click here Click here Click here Click here Click here

13.2 Trademarks

All other trademarks are the property of their respective owners.

13.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.