SNVS174I February   2003  – February 2015 LP3852 , LP3855

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematics
  5. 5 Revision History
  6. 6 Voltage Options
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 SENSE Pin
      2. 9.3.2 SHUTDOWN (SD) Operation
      3. 9.3.3 Dropout Voltage
      4. 9.3.4 Reverse Current Path
      5. 9.3.5 Short-Circuit Protection
      6. 9.3.6 ERROR Flag Operation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation with VOUT(TARGET) + 0.1 V ≤ VIN ≤ 7 V
      2. 9.4.2 Operation With SD Pin Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 External Capacitors
          1. 10.2.2.1.1 Input Capacitor
          2. 10.2.2.1.2 Output Capacitor
        2. 10.2.2.2 Operation with Ceramic Output Capacitors
        3. 10.2.2.3 Selecting A Capacitor
        4. 10.2.2.4 Capacitor Characteristics
          1. 10.2.2.4.1 Ceramic
          2. 10.2.2.4.2 Tantalum
          3. 10.2.2.4.3 Aluminum
        5. 10.2.2.5 Turnon Characteristics For Output Voltages Programmed to 2 V or Below
        6. 10.2.2.6 Output Noise
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 RFI and/or EMI Susceptibility
    4. 12.4 Power Dissipation/Heatsinking
      1. 12.4.1 Heatsinking TO-220 Package
      2. 12.4.2 Heatsinking TO-263 Package
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from H Revision (December 2014) to I Revision

  • Changed pin names to TI nomenclature; correct typos Go
  • Changed pin numbers and I/O types to correct errors Go
  • Changed Handling to ESD Ratings Go

Changes from G Revision (April 2013) to H Revision

  • Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section; updated Thermal Values Go

Changes from F Revision (April 2013) to G Revision

  • Changed layout of National Data Sheet to TI formatGo