SBOS206F January   2001  – October 2023 OPA561

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Adjustable Current Limit
        1. 6.2.1.1 Current Limit Accuracy
        2. 6.2.1.2 Setting the Current Limit
      2. 6.2.2 Enable-Status (E/S) Pin
        1. 6.2.2.1 Output Disable
        2. 6.2.2.2 Maintaining Microcontroller Compatibility
      3. 6.2.3 Overcurrent Flag
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Output Stage Compensation
      2. 7.1.2 Output Protection
      3. 7.1.3 Thermal Protection
      4. 7.1.4 Power Dissipation
      5. 7.1.5 Heat-Sink Area
      6. 7.1.6 Amplifier Mounting
        1. 7.1.6.1 What is the PowerPAD™ Integrated Circuit Package?
        2. 7.1.6.2 PowerPAD™ Integrated Circuit Package Assembly Process
    2. 7.2 Typical Application
      1. 7.2.1 Laser Diode Driver
      2. 7.2.2 Programmable Power Supply
      3. 7.2.3 Power-Line Communication Modem
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1.5 Heat-Sink Area

The relationship between thermal resistance and power dissipation can be expressed as:

Equation 2. θ J A = T J – T A P D

Where:

  • TJ = Junction temperature (°C)
  • TA = Ambient temperature (°C)
  • θJA = Junction-to-ambient thermal resistance (°C/W)
  • PD = Power dissipation (W)
Calculate the appropriate power dissipation to determine required heat-sink area. At the same time, consider the relationship between power dissipation and thermal resistance to minimize shutdown conditions and allow for proper long-term operation (junction temperature of 125 °C). After the heat-sink area has been selected, verify proper thermal protection by testing worst-case load conditions. For applications with limited board size, refer to Figure 7-3 for the approximate thermal resistance relative to heat-sink area. Increasing heat-sink area beyond 2 in2 provides little improvement in thermal resistance. To achieve the 32 °C/W stated in the Electrical Characteristics, a copper plane size of 9 in2 was used. The HTSSOP-20 PowerPAD integrated circuit package is a good choice for continuous power levels from 2 W to 4 W, depending on ambient temperature and heat-sink area. Higher power levels can be achieved in applications with a low on-off duty cycle, such as remote meter reading.

GUID-20230614-SS0I-G3K3-WQHL-SRRSB210KQZN-low.svg Figure 7-3 Thermal Resistance vs Circuit Board Copper Area