SBOS206F January   2001  – October 2023 OPA561

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Adjustable Current Limit
        1. 6.2.1.1 Current Limit Accuracy
        2. 6.2.1.2 Setting the Current Limit
      2. 6.2.2 Enable-Status (E/S) Pin
        1. 6.2.2.1 Output Disable
        2. 6.2.2.2 Maintaining Microcontroller Compatibility
      3. 6.2.3 Overcurrent Flag
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Output Stage Compensation
      2. 7.1.2 Output Protection
      3. 7.1.3 Thermal Protection
      4. 7.1.4 Power Dissipation
      5. 7.1.5 Heat-Sink Area
      6. 7.1.6 Amplifier Mounting
        1. 7.1.6.1 What is the PowerPAD™ Integrated Circuit Package?
        2. 7.1.6.2 PowerPAD™ Integrated Circuit Package Assembly Process
    2. 7.2 Typical Application
      1. 7.2.1 Laser Diode Driver
      2. 7.2.2 Programmable Power Supply
      3. 7.2.3 Power-Line Communication Modem
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The OPA561 is a low-cost, high-current operational amplifier capable of driving up to 1.2-A pulses into reactive loads. This monolithic integrated circuit provides high reliability in demanding line-carrier communications, laser diode drivers, and motor-control applications. The high slew rate provides 1 MHz of full-power bandwidth and excellent linearity.

For design flexibility, the OPA561 operates from either a single supply in the range of 7 V to 15 V or dual power supplies of ±3.5 V to ±7.5 V. In single-supply operation, the input common-mode range extends below ground. At maximum output current, a wide output swing provides a 12 VPP capability with a nominal 15‑V supply.

The OPA561 is internally protected against overtemperature conditions and current overloads. In addition, the OPA561 is designed to provide an accurate, user-selected, current limit. The current limit can be adjusted from 0.2 A to 1.2 A with a low-power resistor or potentiometer, or DAC (digital-to-analog converter). The high-speed characteristics of the current control loop provide accuracy, even under pulsed-load conditions.

The enable and status (E/S) pin performs two functions: the pin can be monitored to determine if the device is in thermal shutdown (active low), and can also be forced low to disable the output, thus disconnecting the load.

The OPA561 is available in a miniature HTSSOP-20 PowerPAD integrated circuit package. This surface-mount package is thermally enhanced and has a very low thermal resistance. Operation is specified over the industrial temperature range of 0°C to 125°C.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
OPA561 PWP (HTSSOP, 20) 6.5 mm × 6.4 mm
(1) For more information, see Section 10.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.

 

GUID-20230614-SS0I-Z1VC-6DNR-7KWS0CHSXSGK-low.svg Pinout Diagram