SBOS206F January 2001 – October 2023 OPA561
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | OPA561 | UNIT | ||
---|---|---|---|---|
PWP (HTSSOP) | ||||
20 PINS | ||||
R θJA | Junction-to-ambient thermal resistance | 2-oz trace and 9-in2 copper pad with solder | 32 | °C/W |
Without heat sink | 100 | |||
R θJC(bot) | Junction-to-case (bottom) thermal resistance | 1.4 | °C/W |