SCES681E January   2008  – April 2024 SN74AUP2G08

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Resistance Characteristics
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics - CL = 5 pF
    7. 5.7  Switching Characteristics - CL = 10 pF
    8. 5.8  Switching Characteristics - CL = 15 pF
    9. 5.9  Switching Characteristics - CL = 30 pF
    10. 5.10 Operating Characteristics
    11. 5.11 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 19
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Partial Power Down (Ioff)
      4. 7.3.4 Standard CMOS Inputs
      5. 7.3.5 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

This dual 2-input positive-AND gate is designed for 0.8V to 3.6V VCC operation and performs the Boolean function Y = A ● B in positive logic.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when VCC = 0V, preventing damaging current backflow through the device when it is powered down.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE (NOM)(3)

SN74AUP2G08

DCU (VSSOP, 8) 3.1mm × 2mm 2.3mm × 2mm
DQE (X2SON, 8) 1mm × 1.4mm 1mm × 1.4mm
RSE (UQFN, 8) 1.5mm × 1.5mm 1.5mm × 1.5mm
YFP (DSBGA, 8) 0.76mm × 1.56mm 0.76mm × 1.56mm
YZP (DSBGA, 8) 0.89mm × 1.89mm 0.89mm × 1.89mm
For more information, see Section 11.
The package size (length × width) is a nominal value and includes pins, where applicable.
The body size (length × width) is a nominal value and does not include pins.
SN74AUP2G08 Simplified Logic Diagram (Positive Logic)Simplified Logic Diagram (Positive Logic)